November_EDFA_Digital

edfas.org 1 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 20 NO. 4 DEPARTMENTS Early Life Automotive Electronics Failu res and Their Root Causes Peter Jacob In automotive electronics, failures are frequently found that cannot be explained by the failure signatures of the defective devices. Most can be prevented by taking careful precautions in the design phase. The author describes several examples andconcludeswith somebasicprinciples for implementing a system level approach to FA. ABOUT THE COVER See page 61 for a description of the contest winners’ collage on the cover. Author Guidelines Author guidelines and a sample article are available at edfas.org . Potential authors should consult the guidelines for useful informa- tion prior to manuscript preparation. 4 16 A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS NOVEMBER 2018 | VOLUME 20 | ISSUE 4 edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS 2 GUEST EDITORIAL Lee Knauss and Zhiyong Wang 38 ANADEF WORKSHOP REPORT Julien Perraud 40 ISTFA 2018 EXHIBITOR S LIST 41 ISTFA 2018 EXHIBITO RS SHOWCASE 42 EDFAS AWARDS 48 MASTER FA TECHNIQ UES Dave Burgess 52 DIRECTORY OF FA PRO VIDERS Rose Ring 54 PRODUCT NEWS Larr y Wagner 58 TRAINING CALENDAR Rose Ring 60 LITERATURE REVIEW Mike Bruce 62 GUEST COLUMNIST Peter Jacob 64 ADVERTISERS INDEX Advanced Packaging Fault Isolation C ase Studies and Advancement of EOTPR Jesse Alton, Thomas White, and Martin Igarashi Electro optical terahertz pulse reflectometry (EOTPR) is now a well-established technique in failure analysis workflows and has been used to interrogate a wide range of distinctive architectures. 24 For the digital edition, log in to edfas.org, click on the “News/Magazines” tab, and select “EDFA Magazine.” High Resolution Acoustic GHz Microscopy Sebastian Brand, Michael Kögel, and Frank Altmann This article describes a novel acoustic inspection tool oper- ating in the GHz band to extend both the lateral resolution and surface and subsurface sensitivity of acousticmicros- copy. Case studies illustrate the potential of GHz-SAM for inspection and analysis especially in high-reliability applications. 16 4 Geolocation of Cu Wires During Sens itive IC Acid Decapsulation Michael Obein As IC packages have improved, the initial quality check of the assembly and any required failure analysis are criti- cal to continued IC progress. Among recent technological advancements is the use of copper wires, which need to be protected by stopping the acid decapsulation process at the right moment. 30 24 30