February_EDFA_Digital

edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 20 NO. 1 2 PURPOSE: To provide a technical condensation of information of interest to electronic device failure analysis technicians, engineers, and managers. Felix Beaudoin E ditor/GLOBALFOUNDRIES; felix.beaudoin@ globalfoundries.com Scott D. Henry Publisher Mary Anne Fleming Manager, Technical Journals Kelly Sukol Production Supervisor Liz Marquard Managing Editor ASSOCIATE EDITORS Nicholas Antoniou Nova Measuring Instruments Guillaume Bascoul CNES France Michael R. Bruce Consultant David L. Burgess Accelerated Analysis Jiann Min Chin Advanced Micro Devices Singapore Edward I. Cole, Jr. Sandia National Labs Szu Huat Goh GLOBALFOUNDRIES Singapore Martin Keim Mentor, A Siemens Business Ted Kolasa Orbital ATK Andreas Meyer GLOBALFOUNDRIES Philippe H.G. Perdu CNES France Rose M. Ring Kionix Sam Subramanian NXP Semiconductors Paiboon Tangyunyong Sandia National Labs David P. Vallett PeakSource Analytical, LLC E. Jan Vardaman TechSearch International, Inc. Martin Versen University of Applied Sciences Rosenheim, Germany Lawrence C. Wagner LWSN Consulting Inc. GRAPHIC DESIGN www.designbyj.com PRESS RELEASE SUBMISSIONS magazines@asminternational.org Electronic Device Failure Analysis™ (ISSN 1537-0755) is pub- lished quarterly by ASM International ® , 9639 Kinsman Road, Materials Park, OH 44073; tel: 800.336.5152; website: edfas. org.Copyright©2018byASM International.Receive Electronic Device Failure Analysis as part of your EDFAS membership of $88 U.S. per year. Non-member subscription rate is $135 U.S. per year. Authorizationtophotocopy itemsfor internalorpersonaluse, orthe internalorpersonaluseofspecificclients, isgrantedby ASM Internationalfor librariesandotherusersregisteredwith theCopyrightClearanceCenter(CCC)TransactionalReporting Service, provided that the base fee of $19 per article is paid directlytoCCC,222RosewoodDrive,Danvers,MA01923,USA. Electronic Device Failure Analysis is indexed or abstracted by Compendex, EBSCO, Gale, and ProQuest. F ifteen years ago, while working as a copyeditor for ASM International, I was presented the opportunity to become Managing Editor of EDFA magazine. A brief outline of my new duties included the following directive: “Go out to California and attend ISTFA.” My response was, “ What is ISTFA?” As you can see, my on-the-job learning curve was not just steep, it was absolutely vertical! With the patience and guidance of then-Editor Chuck Hawkins, my edu- cation began. Chuck graciously answered my numerous questions, even though they must have been extremely elementary to him, such as, “What are MEMS?” I quickly discovered that I needed to learn a foreign language— “acronym-speak”—to decode cryptic manuscript sentences similar to: “The team performed a PFA on the DUT using SEM, FIB, AFM, EMMI, and IREM to search for EOS/ESD in the MOSFET at the FEOL.” Huh? No onewas prouder (ormore relieved!) thanmewhen theNovember 2003 issue—my first as Managing Editor—arrived looking great and containing all the necessary components. Each subsequent issue offered more opportuni- ties for growth and learning. It has been a privilege to help guide themagazine to its current status as a full-color 56+ page quarterly packed with relevant information for a very responsive EDFAS constituency. The best part of the learning curve has been my working relationship with the backbone of EDFA magazine: the Editorial Board and its outstanding former Editors, LarryWagner, ChuckHawkins, Ed Cole, Rose Ring, Mike Bruce, and current Editor, Felix Beaudoin. EDFA magazine is a success because of this incredibly dedicated group of professionals. I thank them for their insight, guidance, and humor as well as their tolerance of my well-known “nag-o- grams.” It has been an honor to work with such a fine and talented Board, who are not only my colleagues but also my friends. After 15 years at EDFA ’s helm, I have come to a pivot point in my life. What I want the most is not new professional challenges but rather the gift of time—time to travel, to play with my grandchildren, to finish writing my second novel, to read recreationally, and to wander away from my desk for long, leisurely spans. My farewell endswith a favorite line, often attributed toDr. Seuss (Theodor Geisel): “Don’t cry because it’s over. Smile because it happened.” I leave you with a smile and a deep sense of gratitude for all that we have experienced and accomplished together. FEBRUARY 2018 | VOLUME 20 | ISSUE 1 A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS ELECTRONIC DEVICE FAILURE ANALYSIS GUEST EDITORIAL THE GIFT OF TIME Liz Marquard, EDFA Managing Editor LZMarquard@aol.com edfas.org