February_EDFA_Digital

edfas.org 1 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 20 NO. 1 DEPARTMENTS Monograin Defect in Polysilicon Gates Thierry Parrassin and Laurent Clément Amonograin defect impacts ICs of nanoscale technology no des. Read about the root-cause analysis that led to the produc tion of dedicated physical and electrical simulation tools to res olve this failure mode. ABOUT THE COVER “Northern Lights through the Dark Side of the Moon.” Voids and dendritic crystal growth observed between a 3 µm optical fiber assembly and coupled silicon die. The 3 µm fiber assembly was parallel polished to inspect the interface between fiber assembly and silicon die. Photo by Kevin Awai, Mellanox Technologies, First Place Winner in Color Images, 2017 EDFAS Photo Contest. Author Guidelines Author guidelines and a sample article are available at edfas.org . Potential authors should consult the guidelines for useful informa- tion prior to manuscript preparation. 4 10 A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS FEBRUARY 2018 | VOLUME 20 | ISSUE 1 edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS 56 ADVERTISERS' INDEX 42 ASM FELLOW 2017 43 BOARD OF DIRECTORS NEWS Bill Vanderlinde 8 CALL FOR NOMINATIONS Cheryl Hartfield 39 CALL FOR PAPERS 54 DIRECTORY OF FA PROVIDERS Rose Ring 40 2017 EDFAS AWARD WINNERS 41 2018 EDFAS AWARDS 55 GUEST COLUMNIST Dave Burgess 2 GUEST EDITORIAL Liz Marquard 52 LITERATURE REVIEW Mike Bruce 38 PHOTO & VIDEO CONTEST WINNERS 44 PRODUCT NEWS Larry Wagner 42 SOCIETY NEWS 48 TRAINING CALENDAR Rose Ring Microstructure and Reliability of Tin-Silver Micro-Copper Pillar Assemblies Mohammed Genanu, Babak Arfaei, Eric J. Cotts, Francis Mutuku, Eric Perfecto, Scott Pollard, and Aric Shorey The relationships between processing, microstructure, and rel i- ability of assemblies enabled through copper pillar/interpose r technology are examined. Each factor can significantly affec t solder joint microstructure and lifetime. 20 For the digital edition, log in to edfas.org , click on the "News/Magazines" tab, and select "EDFA Magazine." Failure Mechanisms of Electromechanical Relays on PCBAs: Part I Gert Vogel This article provides a detailed analysis of electromechanical component failures in printed circuit board assemblies and their corresponding root causes. 10 4 32 DC/DC Converter Fails to Start Up without Overshoot due to Interaction with Inrush Current Suppression Circuitry Guo Xianxin This article explores the failure of a DC/DC converter withou t start-up overshoot and provides solutions to a problem that is relevant to space electronic systems. 32 36 ISTFA 2017 Wrap-Up A recap of the ISTFA 2017 event includes General Chair Sam Subramanian’s wrap-up as well as a list of the winning ISTF A Papers and Posters. Summaries of the Panel Discussion and th e User Groups can be found online at asminternational.org/web / edfas/news/edfa. 20