AMP_06_September_2021

ISTFAEVENT.ORG exhibitor list Allied High Tech Products Applied Beams Barnett Technical Services Bruker Corporation BSET EQ Carl Zeiss Microscopy, LLC Checkpoint Technologies Contech Solutions Inc. Control Laser Corp. EAG Laboratories Ebatco ElectronMicroscopy Sciences Gatan EDAX Hamamatsu Corporation HDI Solutions - Hitachi Herzan LLC Hi-Rel Laboratories ibss Group Imina Technologies SA/ AngstromScientific Integra Technologies JEOL USA JIACO Instruments KEYENCE Corporation of America Kleindiek Inc. Leica Microsystems MASER Engineering B.V. Materials Analysis Technology Nanoscience Instruments Neocera LLC NikonMetrology Nisene Technology Group, Inc. Nordson SONOSCAN OKOS Olympus Oxford Instruments Park Systems Inc. Photothermal SpectroscopyCorp. Quartz Imaging Raith America, Inc. RKD Engineering Corp., Inc. RKD Systems SELA USA Inc. SEMICAPS Siemens EDA – Tessent Silicon Lifecycle Solutions Sigray, Inc. SmarAct Inc. Solecon Labs Ted Pella, Inc. Teledyne Imaging Sensors TeraView LTD TESCANUSA Thermo Fisher Scientific Trion Technology ULTRA TEC Varioscale Inc. Zurich Instruments USA, Inc. Exhibitor list current as of August 16. EXHIBIT HOURS TUESDAY, NOVEMBER | : A.M. – : P.M. WEDNESDAY, NOVEMBER | : A.M. – : P.M. 2.5 and 3D Device Failure Analysis Alternative Energy Board and System Level FA Circuit Edit Competitive Analysis and Reverse Engineering Detecting Counterfeit Microelectronics Diagnostic Testing, Scanning, and Fault Simulations Electronic Device Materials Characterization Emerging FA Techniques and Concepts FA Lab Operations and Management during the Pandemic Time (NEW) FA Techniques Addressing the Challenges of System-in-Package Fault Isolation Future Challenges of FA MEMS and Sensors FA Metrology and In-line Device Characterization Nanoprobing for Fault and Electrical Characterization Novel Memory FA Packaging and Assembly Level FA Power, Discrete, and Optoelectronic Device FA Quantum Circuit FA Sample Preparation and Device Deprocessing Silicon Photonics FA Wireless, Self-Powered Sensors MEMS Failure Analysis Yield and Reliability Enhancement MONDAY, NOVEMBER ISTFA attendees will have the chance to see the latest equipment and tools in action and obtain useful information in a guided tour. Participating companies include: Allied High Tech Products, Mentor, a Siemens Business, Park Systems, RKD Systems, SELA USA Inc., and ULTRA TEC. Preregistration is required. Limit of 100 attendees. Tools Tour will practice any/all safety protocols set forth by the Phoenix Convention Center. KEYNOTE SESSION TECHNICAL PROGRAM TOPICS tools of the trade tour Mahajan SPECIAL CONTESTS See the winners of the EDFAS Video Contest, featuring three-minute videos on failure analysis, as well as the best of the EDFAS Photo Contest, with categories in optical microscopy, SEM/TEM/x-ray/UVmicrographs, and photon emissions. First Place Winner in Color images, 2019 EDFAS Photo Contest. Courtesy of Kevin Awai, Raytheon. TUESDAY, NOVEMBER Dr. Ravi Mahajan, Intel Fellow, will talk on “Advanced Packaging for Heterogeneous Integration” including the value of packaging as anHI platform, key features in leading edge 2D and 3D technologies, and challenges for failure analysis and debug.