edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO.4 46 business and Technical Domain Chair. She provides hands-on technical leadership for complex failure investigations across NXP’s global FA organization and performs advanced electrical failure analysis. She holds a master’s degree in electrical engineering from Texas A&M University and a B.Tech from the National Institute of Technology, Trichy, India. She has authored several peer-reviewed ISTFA and IEEE publications on hard failures, secure IP analyzability, and photon-emission microscopy and has delivered invited seminars at universities and at Failure Analysis Society workshops. She also co-taught the LADA & SDL tutorial at ISTFA, translating laser-interaction physics into practical silicon-debug insights. What drives Sampath most is the belief that failure analysis goes beyond finding defects—it is about asking better questions, mentoring critical thinking, and transforming ambiguity into clarity. She actively serves with ISTFA, WEFA, ASM International, EDFAS, and IEEE. Outside the lab, she is a trained Carnatic music vocalist and an Asian cultural community leader at NXP. She received the SEMICON West 20 Under 30 Award (2025) and the ASM Emerging Professional Achievement Award (2026), recognizing her early-career impact. Eric Yi is a product development engineer in AMD’s Device Analysis Laboratory, specializing in physical failure analysis, advanced electron microscopy, and both package and die-level sample preparation. His technical expertise includes TEM, TEM sample preparation, SEM, and FIB workflows, supporting semiconductor development through detailed device characterization, root-cause analysis, and method development. Yi has authored/coauthored several papers and co-presented the tutorial on Advanced FIB/SEM Sample Preparation and Analysis Techniques at ISTFA. He is a current active committee member of the EDFAS SYP Committee. He holds a masters in materials science and engineering from Columbia University and a bachelor’s degree in materials science and engineering from the University of Michigan. Aidan Parente is a product development engineer in the Device Analysis Lab at AMD’s Austin, Texas campus. He specializes in package-level failure analysis supporting cutting-edge N2 and data center products. Parente holds a bachelor’s degree in mechanical engineering from Union College with a minor in audio engineering. His work centers on applying a broad range of analytical tools and techniques to complex semiconductor packages, including CSAM, 3D x-ray microscopy, surface metrology, LIT, LSM, TIVA, and PEM. In addition to package-level investigations, he is helping to expand and enhance the analytical capabilities within the lab. Outside of his core role at AMD, Parente is actively engaged in the electronic device failure analysis community. He serves as the chair of the EDFAS SYP Committee and participates in the Packaging Innovation Roadmap Committee (PIRC), helping to shape the future direction of packaging and failure analysis technologies. Beyond engineering, Parente is passionate about an active and creative lifestyle, enjoying sports with friends, yoga, hiking, traveling, creating music, attending live performances, and volunteering in his local community. Abhinav Devulapalli graduated in May with a degree in materials science and engineering from The Ohio State University. With a strong interest in electronic materials, he has hands-on experience synthesizing and developing nanomaterials at the intersection of sustainability and advanced applications. A six-time Dean’s List recipient, Devulapalli is committed to continuous learning and professional development, including earning a certificate in Semiconductor Manufacturing and Processing Technologies and actively contributing to the EDFAS SYP Committee. As an EDFAS mentee, Devulapalli leveraged the program to gain industry insight and expand his professional network. He has completed two industry internships supporting failure analysis, corrosion studies, and materials characterization projects. Additionally, he served as a tutor for the Materials Science and Engineering Department, supporting students taking courses in introductory materials science, materials structure and characterization, crystallography, and electronic properties of materials. Devulapalli is motivated to apply his academic, industry, and mentorship experiences toward advancing semiconductor devices, accessible renewable energy technologies, and impactful research. Benny Hsu is a senior device analysis engineer at AMD in Austin, Texas, where he has played a pivotal role in product development and post-silicon debug since 2021. Yi Devulapalli Parente Sampath
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