edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 3 8 (a) (b) (c) (d) (a) (b) Fig. 4 I-V curves of (a) intact and (b) shorted device. Fig. 5 Short in a via chain on a 10 nm processor. (a) Overview SEM image of the via chain. The region of interest, indicated by a white dotted square, is shown in (b) and (c). (b) Raw EBIRCH image. (c) EBIRCH/SEM overlay image highlighting the failure localization (red spot). (d) Overlay image acquired with 300 pA EBIRCH current, note the still visible failure hotspot indicated with the white arrow. The scale bar represents 1 µm.
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