edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 3 32 ISTFA 2026 TECHNICAL SESSIONS Symposium sessions will be packed with high- quality, innovative, and original unpublished pre- sentations: • AI Applications for Failure Analysis • Design for Analysis, Test, and Diagnostics • Device Analysis: Case Studies • Die Level Fault Isolation • Emerging FA Techniques and Concepts • FA at the Next Level: Boards and Systems • FA Process: Fault Isolation, Mechanisms, and Solutions • FIB Sample Prep and Circuit Edit • Hardware Security and Counterfeiting • Microscopy Analysis and Materials • More than Moore: Integrating New Functions into Nanoelectronics • Nanoprobing and Electrical Characterization • Package Level Fault Isolation • Power Devices (Si, SiC, GaN) • Sample Preparation and Device Deprocessing • Scanning Probe Analysis • System-in-Package and 3D Devices methodologies for ensuring that products are inherently more “analysis-ready.” By encouraging open dialogue between designers, test engineers, and failure analysts, this panel aims to identify concrete pathways for closing long-standing gaps and embedding analyzability more deeply into the product lifecycle. ISTFA also continues its strong tradition of fostering collaboration and knowledge exchange through User Group sessions and community-driven discussions. These sessions provide a valuable opportunity to share best practices, discuss common challenges, and engage directly with peers facing similar technical issues. As the complexity of failure analysis continues to grow, these collaborative environments are increasingly important for driving innovation and accelerating problem solving across the community. Another important focus for ISTFA 2026 is engaging and supporting the next generation of engineers through the EDFAS Students and Young Professionals program. On Wednesday, ISTFA will host an enhanced Student Day, where students can attend the conference free of charge. This initiative is designed to lower barriers to participation and introduce students to the field of failure analysis at an early stage in their careers. The program will include specially curated sessions, networking opportunities, and targeted content aimed at providing a strong foundation and sparking long-term interest in the discipline. The ISTFA Expo will once again serve as a central hub of activity throughout the week. Bringing together leading equipment vendors, solution providers, and technology developers, the Expo offers attendees the opportunity to explore the latest advancements in failure analysis tools and techniques while connecting with experts across the ecosystem. ISTFA has long stood as more than just a technical conference. It is a collaborative community dedicated to advancing the science and practice of failure analysis. The ideas exchanged, relationships built, and innovations shared at ISTFA continue to have a lasting impact across the industry. Often, the most valuable insights come from informal discussions with peers. Interactions that frequently lead to lasting professional relationships. As we gather in San Antonio this October, I invite you to be part of this important conversation. Whether you are a long-time contributor or attending for the first time, ISTFA 2026 offers an exceptional opportunity to learn, connect, and help shape the future of failure analysis. I look forward to welcoming you to what promises to be an engaging, insightful, and impactful week. SAVE THE DATE OCTOBER 31 - NOVEMBER 4, 2027 PHOENIX, ARIZONA
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