edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 3 30 ISTFA 2026 PREVIEW ISTFA 2026 Kristofor Dickson, ISTFA 2026 Conference Chair AMD kristofor.dickson@amd.com The 52nd International Symposium for Testing and Failure Analysis (ISTFA) will take place in San Antonio, Texas, from October 4 to 8. This year’s theme, “Design for Analysis,” reflects a meaningful evolution in our industry. One where enabling efficient, effective failure analysis is no longer treated as an afterthought, but instead becomes a foundational consideration throughout the design process. As semiconductor technologies continue to increase in complexity, spanning advanced packaging, heterogeneous integration, photonics, and increasingly system-level architectures, the demands placed on failure analysis are growing rapidly. Traditional approaches are being stretched as devices become more integrated and less accessible, and time-to-root-cause continues to compress. Addressing these challenges requires a new level of alignment across design, test, and failure analysis. ISTFA remains the premier forum where the global community comes together to exchange ideas, share technical advances, and collectively shape how we respond to these emerging challenges. ISTFA 2026 will begin with a strong educational and technical foundation. The conference features 24 in-depth tutorials on Sunday, covering topics such as electrical fault isolation, physical failure analysis, advanced microscopy, system-level debug, and emerging methodologies. These are followed by 17 high-quality technical sessions throughout the week, showcasing innovative, original, and unpublished work from across the global failure analysis community. Under the leadership of Technical Program The Henry B. González Convention Center.
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