edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 2 46 DIRECTORY OF INDEPENDENT FA PROVIDERS Rosalinda M. Ring, NenoVision jmj4papa@yahoo.com Electronic companies of all types and sizes require failure analysis (FA) services. Our goal is to supply a resource of FA service providers for your reference files. The directory lists independent providers and their contact information, expertise, and types of technical services offered. GIDEON ANALYTICAL LABORATORIES INC. 80 Loughran Ln. Highland, NY 12528 845.255.5356 solutions@gideonlabs.com gideonlabs.com/analytical-services Services Offered: Analytical services, failure analysis of electrical components, printed circuit boards, materials, quality control, vendor inspection, and understanding component processes. Tools and Techniques: C-scanning acoustic microscopy (C-SAM), Fourier transform infrared (FTIR-1), gas chromatography–mass spectrometry (GCMS), inductive coupled plasma and atomic absorption, graphite furnace AA (GFAA) aa-55, optical microscopy, scanning electron microscopy (SEM), thermal analysis, x-ray diffraction, x-ray fluorescence spectrometry (XRF), and x-ray radiography. NANOWATTS TECHNOLOGIES PVT. LTD. 80 Feet Rd., RMV 2nd Stage Bangalore 560094, India +91.8217618041 info@nanowattstech.com nanowattstech.com/electronics-testing-lab Services Offered: Nano fabrication, materials characterization, semiconductor IC testing, materials testing lab, electronics testing lab, nano biotech, electron microscopy lab, x-ray inspection facility, polymer rubber test lab, mechanical testing lab, consumer testing lab, PCB quality assurance, IC failure analysis lab, spectrophotometer lab, and XRF testing lab. PHINEAS LABORATORY Georgetown, TX 78628 phineaslaboratory.com Services Offered: Precision materials characterization, failure analysis, cross-sectioning, and R&D services. Tools and Techniques: Optical microscopy, SEM/EDS analysis, cross-sectional analysis, surface analysis, elemental mapping, IC package cross-sections, wire bond inspection, die attach evaluation, solder joint analysis, via and interconnect examination, metallographic preparation, parallel polishing to sub-micron accuracy, chemicalmechanical polishing (CMP), low-speed diamond sawing, SEM, and x-ray spectroscopy (EDS). PRIORITY LABS 1251 S. Sherman St., Suite 109 Richardson, TX 75081 214.926.7523 prioritylabs.com/engineering-services Services Offered: Independent engineering and failure analysis services, root cause analysis, materials characterization, and counterfeit analysis. Tools and Techniques: Scanning acoustic microscopy, cross-sectioning, deprocessing, decapsulation, dye and pry, time domain reflectometry, electrical characterization, counterfeit detection, optical inspection, scanning electron microscopy, and focused ion beam. PROCESS SCIENCES INC. 310 S. Brushy St. Leander, TX 78641 512.259.7070 process-sciences.com/services Services Offered: PCBA failure analysis, BGA x-ray inspection, CT x-ray inspection with 3D volume reconstruction, microsectional analysis, dye and pry test, counterfeit detection service, C3 ionic cleanliness testing, rework services, training courses, x-ray inspection training class, SMT bootcamp, and SMT process consulting. Tools and Techniques: SEM/EDS analysis, ion chromatography, and XRF plating analysis. QUASI-S PTE. LTD. 35 Marsiling Industrial Estate Rd. 3 #04-03 Singapore 739257 +65.6383.4386 contact@quasi-s.com labs-services.com/product-category/failure-analysis Services Offered: Failure analysis, chemical testing, metallurgy analysis, counterfeit analysis, forensic science, nondestructive test, and sample preparation. Tools and Techniques: 2D/3D x-ray, atomic absorption spectroscopy (AAS), atomic force microscopy (AFM), auger electron spectroscopy (AES), confocal scanning acoustic microscopy (CSAM), decapsulation, dye and pry, electrical verification bench, testing, electron backscatter diffraction (EBSD), electron energy loss spectroscopy (EELS), electron spectroscopy for chemical analysis (ESCA/XPS),
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