edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 2 44 provide a wide field of view, along with several objective lenses capable of resolving fine details up to 1.3 µm. Hot spots can be detected with high sensitivity at chip level using as little as 2 µA. To excite power modules, high voltages up to 3 kV are applied. The analysis is performed using InfraTec’s IRBIS 3 active online operating software, which offers a wide range of comprehensive analysis functions. The use of various color palettes, including inverted and weighted modes, has proven particularly effective for fault detection. For more information, visit infratec-infrared.com. ECOSYSTEM ACCELERATES CHIPLET TIME TO MARKET Cadence announced a Chiplet Spec-to-Packaged Parts ecosystem to reduce engineering complexity and accelerate time to market for customers developing chiplets targeting physical AI, data center, and high-performance computing (HPC) applications. Initial IP partners include Arm, Arteris, eMemory, M31 Technology, Silicon Creations, and Trilinear Technologies, as well as silicon analytics partner proteanTecs. To help reduce risk and streamline customer adoption, Cadence is collaborating with Samsung Foundry to build out a silicon prototype demonstration of the Cadence Physical AI chiplet platform, including pre-integrated partner IP on the Samsung Foundry SF5A process. Extending their longstanding history of close collaboration, Cadence and Arm are working together to accelerate innovation across physical and infrastructure AI applications. Cadence will leverage the advanced Arm Zena Compute Subsystem and other essential IP to enhance Cadence’s Physical AI chiplet platform and chiplet framework. The resulting new Cadence solutions accommodate the demanding next-generation edge AI processing requirements for automobiles, robotics and drones, as well as the needs of standards-based I/O and memory chiplets for data center, cloud, and HPC applications. The alliances reduce engineering complexities, offer customers a low-risk path to advanced chiplet adoption and pave the way for smarter, safer, and more efficient systems. For more information, visit cadence.com. MILLIPORE SIGMA OFFERS A SERIES OF OLED AND PLED MATERIALS The organic light-emitting diode (OLED) is a highperformance optoelectronic device consisting of charge transport and emissive organic layers. Upon applied voltage, the dual carrier injection system of the OLED supplies both electrons and holes to the electroluminescent material between two electrodes, resulting in its characteristic electroluminescent light with specific color and device performance, depending on the organic materials employed in the device. The two main classes of OLEDs include small-molecule based light emitting diodes and polymer-based light emitting diodes (PLEDs). A typical double-heterostructure smallmolecule OLED consists of three organic layers sandwiched between electrodes. The organic layers adjacent to the cathode and anode are the electron transport layer and the hole transport layer, respectively. The emissive layer usually consists of light-emitting dyes or dopants dispersed in a suitable host material. PLEDs have relatively simple architectures, with the light-emitting polymer (LEP) layer combining host, emitter, and charge transport functions in a single solution-processed layer of the device. Millipore offers a series of high purity, state-of-the-art OLED mater- Cadence’s Chiplet Spec-to-Packaged Parts ecosystem reduces engineering complexity and accelerates time to market.
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