edfas.org 3 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 2 DESIGN FOR ANALYSIS To learn more and find registration details, visit: REGISTRATION OPENS THIS SUMMER! OCTOBER 4–8, 2026 HENRY B. GONZALEZ CONVENTION CENTER, SAN ANTONIO, TEXAS Join us for the 52nd International Symposium for Testing and Failure Analysis (ISTFA), which is set to take place in San Antonio, Texas, from October 4-8, 2026. As the premier event for the microelectronics failure analysis community, ISTFA brings together leading experts, industry professionals, and researchers to share insights, innovations, and methodologies in the field. Attendees will engage in a comprehensive program that includes keynote presentations, technical sessions, workshops, and networking opportunities, all designed to foster collaboration and knowledge exchange. Topics will include: WHAT TO EXPECT AT ISTFA 2026 • AI Applications for Failure Analysis • Design for Analysis, Test, and Diagnostics • Device Analysis – Case Studies • Die Level Fault Isolation • Emerging FA Techniques and Concepts • FA at the Next Level – Boards and Systems • FA Process: Fault Isolation, Mechanisms, and Solutions • FIB Sample Preparation and Circuit Edit • Hardware Security and Counterfeiting • Keynote Presentations that open the conference with insights from global leaders in failure analysis, reliability engineering, and materials science. • Technical Sessions covering a broad range of failure analysis topics, including case studies, advanced characterization techniques, emerging technologies, and real-world industry applications. • Panel Discussions featuring experts from academia, industry, and government offering diverse perspectives on current challenges and future trends in the failure analysis community. • Microscopy Analysis and Materials Characterization • More than Moore: Integrating New Functions into Nanoelectronics • Nanoprobing and Electrical Characterization • Package Level Fault Isolation • Power Devices (Si, SiC, GaN) • Sample Preparation and Device Deprocessing • Scanning Probe Analysis • System-in-Package and 3D Devices • Workshops and Tutorials designed to provide handson learning and deeper engagement with advanced analytical methods and tools. • Exhibit Hall Hours where attendees can connect with leading suppliers, explore new instrumentation and technologies, and engage directly with solution providers. • Networking Opportunities, including the ISTFA Social Networking Event and additional communitybuilding activities throughout the week. • Student Competitions that support and celebrate the next generation of failure analysis professionals.
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