edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 2 10 REFERENCES 1. Z. Tokei, et al.: “A Path to High-density Front and Backside Wafer Connectivity,” Chip Scale Review, 29(4), p. 20-29, Jul.-Aug. 2025. 2. K. Nikawa and S. Inoue: “New Capabilities of OBIRCH Method for Fault Localization and Defect Detection,” Proceedings Sixth Asian Test Symposium (ATS ’97), Akita, Japan, 1997, p. 214-219, doi.org/10.1109/ ATS.1997.643961. 3. K.J.P. Jacobs, et al.: “Fault Isolation of Resistive/Open 3-D Wafer Bonding Interconnects by Thermal Laser Stimulation and LightInduced Capacitance Alteration,” Proc. Int. Symp. Test. Fail. Anal. (ISTFA), Nov. 2020, p. 6-11, doi.org/10.31399/asm.cp.istfa2020p0006. 4. K.J.P. Jacobs, et al.: “Light-Induced Capacitance Alteration for Nondestructive Fault Isolation in TSV Structures for 3-D Integration,” Proc. Int. Symp. Test. Fail. Anal. (ISTFA), 2016, p. 418-425, doi.org/10.31399/ asm.cp.istfa2016p0406. 5. K.J.P. Jacobs, et al.: “Lock-in Thermal Laser Stimulation for Nondestructive Failure Localization in 3D Devices,” Microelectronics Reliability, 2017, 76-77, p. 188-193, doi.org/10.1016/j.microrel. 2017.06.034. 6. H. Kim, et al.: “3D-VNAND Depth Measurement using OFI Lock-In OBIRCH,” Proc. Int. Symp. Test. Fail. Anal., 2025, p. 563-566, doi. org/10.31399/asm.cp.istfa2025p0563. 7. K.J.P. Jacobs and E. Beyne: “Defect Localization Approach for Wafer-to-Wafer Hybrid Bonding Interconnects,” IEEE Transactions on Semiconductor Manufacturing, Nov. 2023, 36(4), p. 673-675, doi. org/10.1109/TSM.2023.3311452. 8. K.J.P. Jacobs, M. Stucchi, and E. Beyne: “Localization of Electrical Defects in Hybrid Bonding Interconnect Structures by Scanning Photocapacitance Microscopy,” IEEE Transactions on Instrumentation and Measurement, 2021, 70, p. 1-7, Art no. 3523907, doi.org/10.1109/ TIM.2021.3108531. 9. L. Witters, et al.: “High-Density Wafer Level Connectivity using Frontside Hybrid Bonding at 250 nm Pitch and Backside Through- Dielectric Vias at 120 nm Pitch After Extreme Wafer Thinning,” 2025 Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2025, p. 1-3, doi.org/10.23919/VLSITechnologyandCir65189. 2025.11075104. 10. X. Mao, et al.: “High Resolution Imaging of Thick SI Device using Doublet SIL,” Proc. IEEE Int. Symp. Phys. Fail. Anal. Integr. Circuits (IPFA), 2020, p. 1-5, doi.org/10.1109/IPFA49335.2020.9260936. 11. K.J.P. Jacobs: “Enhancing Imaging Resolution of Microscopy-based Debug Techniques with On-chip Microelectrodes,” 43rd NANO Test. Symp. (NANOTS), Nov. 2023, p. 125-130. 12. K.J.P. Jacobs: “Inkjet-printed Electrical Interconnects for High Resolution Integrated Circuit Diagnostics,” Commun Eng 2, 2023, 21, doi.org/10.1038/s44172-023-00073-4. 13. K.J.P. Jacobs, et al.: “Innovations in Beam-based Defect Localization Methods for Advanced 3D Interconnects,” Proc. Int. Symp. Test. Fail. Anal., 2024, p. 231-241, doi.org/10.31399/asm.cp.istfa2024p0231. ABOUT THE AUTHOR Kristof J.P. Jacobs is a principal member of technical staff in the Advanced Reliability Robustness and Test (AR2T) department at imec in Leuven, Belgium. He obtained his Ph.D. in electrical and electronic engineering in 2015 from the University of Sheffield, U.K. His doctoral work contributed to the development of resonant tunneling diodes for terahertz sensing and communication applications. He joined imec in 2015 where his research focuses on advancing failure analysis methods for advanced compute and memory technologies. IPFA 2026 The 33rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) will be held July 13-16 at the Marina Bay Sands in Singapore. The event will focus on cutting-edge research in failure analysis, reliability, and specialized technology within integrated circuits. Topics include advanced fault isolation techniques, physical and package-level failure analysis, transistor reliability, ESD and latch-up mechanisms, and the integration of AI for failure detection and reliability assessments. The symposium is technically sponsored by the IEEE Electron Devices Society. For more information, visit the IPFA website at ipfaieee.org/2026. NOTEWORTHY NEWS
RkJQdWJsaXNoZXIy MTYyMzk3NQ==