edfas.org 51 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 1 simulations. I knew how to run the simulation software and was a pro at making cool raytracing plots. I had, however, lost the routine for turning the coordinate sys- tem into the declared-variable-array coordinate system. I told Malex of my predicament, and within an hour, he provided me with a custom Python routine that enabled me to make the conversion.” After completion of this pilot program, the authors found that there are areas for improvement to be addressed as the program evolves. For example, pairing mentors and mentees with similar goals, such as active job seeking or technical knowledge exchange, providing a comprehensive welcome mentor/mentee packet, and smoothing the onboarding/offboarding process. There is a lot of work remaining and they are asking for your help to strengthen this mentorship community. In 2026, the authors plan to launch a quarterly recruitment cycle for mentors, mentees, and supporting volunteers. To be eligible as a mentee, applicants must be current or former members of the EDFAS Student & Young Professional (SYP) Committee. Founded in 2023, the SYP Committee is dedicated to building the future workforce and technical leaders in microelectronics FA. On an annual basis from November through December, the committee recruits students who have an interest in microelectronics/FA and/or emerging professionals and are in their career within five years of their graduation. Prospective SYP members can contact Member Services (memberservicecenter@asminternational.org) for additional details. Mentor recruitment will remain by invitation; however, those interested in serving as future mentors are encouraged to contact Phil, an EDFAS Student Board member, an EDFAS board member, or ASM staff. The authors are excited about the growth of this mentorship program and look forward to welcoming you into our growing mentorship community! ESREF 2026 The 37th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2026) will take place September 21-24 in Vienna. This international symposium has a focus on reliability in all aspects of electronics including new applications in extremely harsh environments such as space, transport, energy conversion, and smart functions. It provides the leading European forum for developing all aspects of reliability management and innovative analysis techniques for present and emerging semiconductor applications. For more information, visit esref2026.org. NOTEWORTHY NEWS MICROSCOPY & MICROANALYSIS MEETING 2026 The Microscopy & Microanalysis (M&M) 2026 meeting will be held August 2-6 in Milwaukee. The scientific program features the latest advances in biological, physical, and analytical sciences as well as techniques and instrumentation. Complementing the program is one of the largest exhibitions of microscopy and microanalysis instrumentation and resources in the world. Educational opportunities include a variety of Sunday short courses, tutorials, workshops, and pre-meeting congresses for early-career scientists. M&M is sponsored by the Microscopy Society of America, the Microanalysis Society, and the Microscopical Society of Canada. For more information, visit microscopy.org/Events.
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