edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 1 48 TRAINING CALENDAR LIFELONG LEARNING EDFAS believes in lifelong learning and supporting our members and customers in that endeavor. Our goal is to provide a list of educational resources in failure analysis and related topics in each issue of EDFA magazine. In addition, explore all EDFAS has to offer from regional events, chapter courses, and tutorials and courses during ISTFA. Find out more by visiting edfas.org. Rosalinda M. Ring, NenoVision jmj4papa@yahoo.com EVENT DATE LOCATION Principles of Failure Analysis 2/2-4 Virtual Event Introduction to Metallography 2/16-17 Novelty, OH Metallurgy for the Non-Metallurgist 2/16-19 Virtual Event Practical Fractography 2/23-24 Virtual Event Metallographic Techniques 2/23-26 Novelty, OH Contact: ASM International Pan Pacific Strategic Electronics Symposium 2/2-5 Big Island, HI Contact: SMTA Pan Pac Asia Photonics Expo 2/4-6 Singapore Contact: Asia Photonics Expo SEMICON Korea 2/11-13 Seoul, Korea Contact: SEMICON Korea Austin Expo and Tech Forum 2/12 Austin, TX Contact: SMTA IEEE International Solid-State Circuits Conference 2/15-19 San Francisco, CA Contact: ISSCC Wafer-Level Packaging Symposium 2/17-19 Burlingame, CA Contact: SMTA Wafer Chiplet Summit 2/17-19 Santa Clara, CA Contact: Chiplet Summit Defect-Based Testing 2/19-20 Munich, Germany Wafer Fab Processing 2/23-26 Munich, Germany Contact: Semitracks Inc. SPIE Advanced Lithography + Patterning 2/22-26 Santa Jose, CA Contact: SPIE February 2026 EVENT DATE LOCATION Florida Semiconductor Summit 2/23-26 Orlando, FL Contact: Florida Semiconductor Summit FLEX 2026— Technology Summit 2/24-26 Phoenix, AZ Contact: FLEX 2026 February 2026 (cont’d) EVENT DATE LOCATION How to Organize and Run a Failure Investigation 3/2-4 Virtual Event Advanced Metallographic Techniques 3/9-12 Novelty, OH Contact: ASM International Design and Verification Conference and Exhibition 3/2-5 Santa Clara, CA Contact: DVCON IMAPS Device Packaging Conference 3/2-5 Phoenix, AZ Contact: IMAPS Failure and Yield Analysis 3/2-5 Munich, Germany Semiconductor Reliability and Product Qualification 3/9-12 Munich, Germany EOS, ESD, and How to Differentiate 3/16-17 Munich, Germany Contact: Semitracks Inc. Embedded World 3/10-12 Nuremberg, Germany Contact: Embedded World SNUG Silicon Valley 3/11-12 Santa Clara, CA Contact: SNUG SV March 2026
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