edfas.org 45 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 1 LITERATURE REVIEW The current column comprises peer-reviewed articles published since 2023 on proximity and near field techniques. These are techniques that require a probe or tip to be in proximity of the surface to be analyzed. These techniques can achieve extremely high resolution, in some cases atomic resolution. Examples include atomic force microscopy, near scanning optical microscopy, scanning probe microscopy, and scanning thermal microscopy. Note that inclusion in the list does not vouch for the article’s quality and category sorting is by no means strict. If you wish to share an interesting, recently published peer-reviewed article with the community, please forward the citation to the email address listed above and I will try to include it in future installments. Entries are listed in alphabetical order by first author, then title, journal, year, volume, and first page. Note that in some cases bracketed text is inserted into the title to provide clarity about the article subject. Peer-Reviewed Literature of Interest to Failure Analysis: Proximity and near field techniques Michael R. Bruce, Consultant mike.bruce@earthlink.net • T. Adlmaier, et al.: “Improved 2D Charge Carrier Quantification Workflow for Scanning Spreading Resistance Microscopy,” Microelectronics Reliability, 2025, 168, p. 115646, doi.org/10.1016/j.microrel.2025. 115646. • K. Bian, et al.: “A Scanning Probe Microscope Compatible with Quantum Sensing at Ambient Conditions,” Rev. Sci. Instrum., 2024, 95, p. 053707, doi.org/10.1063/5.0202756. • N. Budai, et al.: “High-Resolution Magnetic Imaging by Mapping the Locally Induced Anomalous Nernst Effect using Atomic Force Microscopy,” Appl. Phys. Lett., 2023, 6, p. 102401, doi.org/10.1063/5.0136613; also see A. Thompson, “Probing Magnetic Structure at the Nanoscale with Local Thermal Flow Injection,” Scilight, 2023, p. 101101, doi.org/10.1063/ 10.0017629. • L. Dumas, et al.: “Methodology of Backside Preparation Applied on a MRAM to Lead a Logical Investigation with a Near-Field Probe [C-AFM and SSRM],” Microelectronics Reliability, 2023, 150, p. 115102, doi.org/10.1016/j.microrel.2023.115102. • B. Eckmann, et al.: “Coaxial Tips for a Scanning Microwave Microscope and Its Calibration with Dielectric References,” Meas. Sci. Technol., 2024, 35, p. 085010, doi.org/10.1088/1361-6501/ad480d. • M. Garsi, et al.: “Three-Dimensional [Magnetic] Imaging of Integrated-Circuit Activity using Quantum Defects in Diamond,” Phys. Rev. Applied, 2024, 21, p. 014055, doi.org/10.1103/ PhysRevApplied.21.014055. • S. Kang, et al.: “Machine Learning-Enabled Autonomous Operation for Atomic Force Microscopes,” Rev. Sci. Instrum., 2023, 94, p. 123704, doi.org/10.1063/5.0172682. • P. Kehayias, et al.: “High-Resolution Short-Circuit Fault Localization in a Multilayer Integrated Circuit using a Quantum Diamond Microscope [Magnetic Imaging],” Phys. Rev. Applied, 2023, 20, p. 014036, doi.org/10.1103/PhysRevApplied.20.014036. • P. Ma, et al.: “Terahertz Near-Field Imaging of Buried Structures,” Opt. Express, 2024, 32, p. 39785, doi.org/10.1364/OE.532478. • D. Tami, et al.: “Scanning Microwave Impedance Microscopy and its Applications: A Review,” APL Mater., 2025, 13, p. 010602, doi.org/10.1063/ 5.0241574. • Y. Wang, et al.: “Improved Sensitivity for Subsurface Imaging by Contact Resonance Atomic Force Microscopy using Fano Peaks,” AIP Advances, 2024, 14, p. 095209, doi.org/10.1063/5.0219230; also see M. Johnson-Groh: “Rarely Studied Asymmetric Peaks Found to Improve Subsurface Imaging,” Scilight, 2024, p. 361104, doi.org/10.1063/10.0028763. • H.F. Wen, et al.: “[Sub-Surface] Imaging Electromagnetic Boundary of Microdevice using a Wide Field [(Diamond NV) Magnetic] Quantum Microscope,” Opt. Express, 2024, 32, p. 10829, doi. org/10.1364/OE.514770. • S. Zheng, et al.: “Localization of Heavy Doping Missing Defect in MOSFET by the Combined use of Nanoprobing Analysis and SCM Technique,” Microelectronics Reliability, 2025, 168, p. 115707, doi.org/10.1016/j.microrel.2025.115707.
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