edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 1 44 thickness, metallization thickness, wafer thickness, die back metallization, via metallization, SEM metallization inspection, x-ray inspection, computed topography 3D x-ray, sub-micron real time x-ray, electrical testing, DWV (dielectric withstanding voltage), intermittent operating life (IOL), and IR (insulation resistance). PRIORITY LABS 1251 S. Sherman St., Suite 109 Richardson, TX 75081 214.926.7523 prioritylabs.com Services Offered: Integrated circuit, semiconductor, printed circuit board, electronic module, passive discrete components, and general electronics failure analysis. Tools and Techniques: Scanning acoustic microscopy, cross-sectioning, deprocessing, decapsulation, dye and pry, time domain reflectometry, electrical characterization, counterfeit detection, optical inspection, scanning electron microscopy, and focused ion beam. ROCKY MOUNTAIN LABORATORIES INC. 602 Park Point Dr., Suite 101 Golden, CO 80401 303.526.9449 800.776.5227 rockymountainlabs.com Services Offered: Surface analysis, materials characterization, organic analysis, and metallography. Tools and Techniques: Auger electron spectroscopy (AES) analysis, energy dispersive x-ray spectroscopy (EDS) analysis, Fourier transform infrared spectroscopy (FTIR) analysis, optical microscopy analysis, scanning electron microscopy (SEM) analysis, secondary ion mass spectrometry (SIMS) analysis, scanning probe microscopy/ atomic force microscopy (SPM/AFM) analysis, x-ray photoelectron spectroscopy (XPS) analysis, cross-sections and metallography laboratory, Cr(VI) ROHS testing laboratory, Sematech analysis, and SEMI standards analysis laboratory. SEM LAB INC. 20219 10th Pl., SE Snohomish, WA 98290 425.335.4400 info@semlab.com semlab.com/services/electronic-component-failure- analysis Services Offered: Failure analysis, process consulting, and design support for electronics manufacturing. Tools and Techniques: Scanning electron microscopy services, electronic component failure analysis, materials analysis, general failure analysis, SEM/EDS analysis, FTIR analysis, and microscopy. SPIRIT ELECTRONICS 11202 N. 24th Ave. Phoenix, AZ 85029 480.998.1533 info@spiritelectronics.com spiritelectronics.com Services Offered: Electronics analytical services and device physical analysis. Tools and Techniques: Nondestructive bench-top testing: curve tracers, logic analyzer and data generator, oscilloscope, internal and external visual inspections, acoustic microscopy inspection, real-time x-ray inspection, IR microscopy (thermal imaging), x-ray fluorescence (XRF), micro-FTIR (organic substance identification), circuit-board-assembly, printed circuit board assemblies, visual inspection (based on IPC specifications), crosssectioning, potted cross-sectioning, thermal (IR) imaging, dye and pry (BGA package) solderability analysis, hi-pot and insulation resistance testing, heat resistance, solderability, high-speed & low-speed, diamond saws, parallel lapping, ICs, discretes, semiconductors, cross-sectioning, potted cross-sections, deprocessing: wet, dry and parallel lapping, plastic package decappers, probe station, IR (thermal) microscopy, SEM inspection, focused ion beam (FIB) editing, FIB cross-sections, FIB TEM prep and STEM/ TEM imaging, photon emission microscopy (PEM aka LEM and EMMI), dry etching (oxides and package decaps), SIMS and TOF-SIMS, component verification, visual inspection: device markings, dimensions, lead finish, remarking, datasheet comparison, x-ray inspection, XRF inspection (RoHS), acoustical inspection, decapsulation, die inspection (low-mag, high-mag), SEM inspection, electrical testing (bench-top), cross-sectioning, deprocessing, energy dispersive spectroscopy (EDS), and elemental analysis. Advertise in Electronic Device Failure Analysis magazine! For information about advertising in Electronic Device Failure Analysis: KJ Johanns, Business Development Manager 440.671.3851, kj.johanns@asminternational.org Current rate card may be viewed online at asminternational.org/advertise.
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