edfas.org 43 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 1 DIRECTORY OF INDEPENDENT FA PROVIDERS Rosalinda M. Ring, NenoVision jmj4papa@yahoo.com Electronic companies of all types and sizes require failure analysis (FA) services. Our goal is to supply a resource of FA service providers for your reference files. The directory lists independent providers and their contact information, expertise, and types of technical services offered. IC FAILURE ANALYSIS LAB 3506 W. Lake Center Dr., Suite D Santa Ana, CA 92704 949.329.0340 info@icfailureanalysis.com icfailureanalysis.com Services Offered: IC failure analysis, reliability testing, PCB cost analysis, PCB failure analysis, and reverse engineering. Tools and Techniques: Optical microscope, scanning acoustic microscopy (SAM), IC x-ray, x-ray (2D) examination, I-V (curve trace) measurement, chemical/laser decapsulation, photo emission microscopy, (EMMI/OBIRCH), delayering/parallel lapping, electron microscope services, scanning electron microscopy, counterfeit component authenticity, cross-sectioning, energy-dispersive x-ray spectroscopy, FIB precision cutting, secondary ion mass spectrometry, x-ray (3D) examination, atomic force microscopy analysis, dye and pry analysis, IC/package/ PCB reverse engineering, optical profiler, scanning capacitance microscopy, scanning capacitance microscopy, and transmission electron microscopy. INFINITA LAB INC. 39899 Balentine Dr., Suite 200 Newark, CA 94560 888.878.3090 hello@infinitalab.com infinitalab.com/product-testing-service/failure-analysis- in-semiconductors Services Offered: Metrology testing, material testing, and product testing. Tools and Techniques: FTIR, Raman, XRF, OES, SIMS, GD-MS, ICP-MS, ICP-OES, LIBS, XRD, EXAFS, XPS, XRR, and thermal/mechanical testing, scanning electron microscopy (SEM), energy dispersive x-ray spectroscopy (EDS), fractography, thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), optical emission spectroscopy (OES), x-ray fluorescence (XRF), and Fourier transform infrared (FTIR) spectroscopy, environmental and reliability testing, temperature and humidity cycling, thermal shock & vibration tests, solar radiation testing, salt-fog testing, reliability testing, ingress protection (IP) testing, spraying water test (IPX3), splashing water test (IPX4), optical and material characterization, and refractive index (RI) testing. ONEIDA RESEARCH SERVICES INC. 8282 Halsey Rd. Whitesboro, NY 13492 315.736.5480 orslabs.com Services Offered: Analytical testing services. Tools and Techniques: Hydrogen outgassing, moisture/corrosion control, process control, RGA data interpretation, materials and surface analysis, ASTM E595 outgassing testing, energy dispersive x-ray spectroscopy (EDS), micro-Fourier transform infrared, spectroscopy (micro-FTIR), thermal gravimetric analysis–mass spectrometry (TGA-MS), ultra-high vacuum evolved gas analysis (UHV-EGA), XRF elemental analysis, mechanical testing, ball shear strength, bond strength, constant acceleration testing, contact retention, die shear strength, fiber integrity testing, glassivation layer integrity, insert retention, lead integrity, mechanical shock testing, particle impact noise detection (PIND), plating adhesion, random vibration testing, resistance to solvents testing, semiconductor parametric testing and characterization, solder heat resistance test (SHRT), solderability testing, transportation testing, variable frequency vibration testing, optical microscopy, digital microscopy, external visual inspection, fluorescence microscopy, internal visual inspection, SAM, organic mass spectrometry, chemical analysis, contamination analysis, GC/MS, IVA/GC/MS, material outgassing, residual solvents, static headspace GC/MS, package gas analysis (RGA), gas analysis of sealing chamber atmosphere (sampling cylinder rentals available), getter sorption testing, high-resolution IVA testing, material outgassing studies, residual solvents, PCB testing, IPC-A-600 inspection, IPC-TM-650 A/B and D coupon testing, IPC-TM650 thermal stress, plated through holes, ion milling, micro cross-sectioning, nitric and sulfuric decapsulation, wet or plasma etch deglassivation, laser decapsulation, scanning electron microscopy and surface analysis, high-resolution field emission SEM (FE-SEM), Robinson backscattered electron imaging (BSE), scanning electron microscopy (SEM), SEM metallization inspection, wafer lot acceptance testing, glassivation
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