edfas.org 41 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 1 BOARD OF DIRECTORS NEWS EDFAS BOARD OF DIRECTORS REPORT Chris Richardson, EDFAS Secretary, Allied High Tech Products Inc. crichardson@alliedhightech.com “ISTFA 2025 PROVED TO BE A RESOUNDING SUCCESS, FEATURING MORE THAN 100 PAPERS BREAKING OUT INTO ORAL AND POSTER PRESENTATIONS, SIX USER GROUPS, 25 TUTORIALS, A PANEL DISCUSSION, AND TWO KEYNOTE ADDRESSES.” The EDFAS Board of Directors convened its annual face-to-face meeting in Pasadena, Calif., ahead of ISTFA 2025, with the theme of “Scaling Beyond Moore’s Law: Heterogeneous Computing and Advanced Packaging.” EDFAS board president Renee Parente opened the meeting with gratitude for the dedication and hard work of all board members and volunteers. She welcomed our new incoming Members-at-Large, Vinod Narang, Bhanu Sood (beginning a second three-year term) and Mrunal Shah (student member). Parente reflected on a highly successful year, emphasizing aligning with ASM’s strategic priorities: membership network growth, technical content development, and strategic partnerships. These initiatives reinforce our Society’s vision of Engage, Empower, and Expand. A notable update was approved to Section II of the Board Operating Procedures, changing the classification of a “Student Board Member” to “Student and Young Professional Board Member.” This reclassification broadens the scope of the position, ensuring inclusivity for EDFAS members at the earliest stages of their careers. By opening the role to both students and young professionals, the Board aims to strengthen engagement and representation among emerging leaders in the field. Last year, the FA Roadmap committee successfully rebranded to “International Roadmap for Failure Analysis.” This rebranding strengthens EDFAS’s global impact as an authoritative reference guiding vendors, companies, and research institutions. The newly formed FA Outreach Council will further expand engagement with U.S. CHIPS Act Initiatives, IEEE and SRC stakeholders, and international conferences and workshops. The roadmap will now follow a three-year cycle: two years of gap refinement followed by one year of solutions to gaps. The Membership Subcommittee’s webinar series con- tinues to thrive, offering one-hour seminars on career, leadership, and technical topics. Highlights from 2025 included talks by Martine Simard-Normandin, Rick Livengood, David MacMahon, Valerie Brogden, and Joy Liao. Recordings remain accessible through ASM Connect, ensuring members can benefit from these insights year-round. Felix Beaudoin, our Awards and Nominating Committee chair, proudly announced the creation of the EDFAS Volunteering Excellence Award honoring members who exemplify the highest ideals of volunteer service. At ISTFA, David Su received the 2025 Lifetime Achievement Award and Susan Li was honored with the 2025 President’s Award. EDFAS also celebrates two new ASM Fellows, Nicholas Antoniou and Ingrid De Wolf. EDFA magazine, under the editorship of Nicholas Antoniou, continues to deliver high-quality technical content while meeting fiscal goals. Members are encouraged to submit research papers in subjects such as AI for FA, quantum computing, and advanced packaging, to further enrich the publication. ISTFA 2025 proved to be a resounding success, featuring more than 100 papers breaking out into oral and
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