edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 1 38 of technical methodologies and instruments that can help with the investigations to find the root causes of failures. I appreciated the range and depth of the program, as it covered traditional techniques to innovative ones that are starting to gain traction,” said Samuel Byun, Molecular Vista. EDFAS SILICON VALLEY EFA WORKSHOP: AN IN-DEPTH LOOK By popular demand, a second Silicon Valley workshop was held on December 3 at Eurofins EAG Laboratories in Sunnyvale, Calif. The day featured inspiring and informative technical presentations, lab tours, and demos featuring various cutting-edge FA tools in the industry. With 21 different semiconductor companies represented, the event covered critical topics in EFA. The workshop was supported by major electronic companies in the industry, allowing attendees to learn real-world techniques and forward-thinking ideas to elevate their careers. A second EFA workshop was held in December due to popular demand. Attendees had the chance to explore relevant and emerging trends and innovations in FA, to connect directly with renowned industry technologists and peers, and gain practical insights and techniques to enhance their careers. GUEST EDITORIAL CONTINUED FROM PAGE 2 Later, my work shifted to imec’s 3D integration program, which brought new FA challenges and opportunities for ISTFA talks and tutorials on FA for 3D technologies. Today, imec continues to push technology forward in col- laboration with industrial partners, research centers, and universities. With hybrid bonding, micro-bumps, nanothrough silicon vias, backside power delivery network, 2 nm technology with gate-all-around and complementary field-effect transistor architectures, active silicon photonics interposers and nano-ridge lasers, and the combination of all into chiplets, failure analysis is becoming even more complex and exciting. A strong FA community is essential to tackle these challenges—so attend ISTFA and keep networking! Working at imec, combined with teaching at the university, allowed me to navigate across diverse research topics; a bit of everything, and everything a bit. I have always loved the thrill of research, the excitement of discovery, and the privilege of collaborating with brilliant minds worldwide. I could not have achieved what I have without the support of so many of you. Thank you all; you have made this journey truly rewarding. REFERENCES 1. J. Kölzer, et al.: “Quantitative Emission Microscopy,” J. Appl. Phys., 1992, 71(11), R23-R41, doi.org/10.1063/1.350466. 2. Y.Y. Liu, et al.: “A New Spectroscopic Photon Emission Microscope System for Semiconductor Device Analysis,” Proc. Int. Symp. Phys. Fail. Anal. Integ. Circ., 1995, p. 60-65, doi.org/10.1109/ IPFA.1995.487596.
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