edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 1 24 ISTFA 2025 ORGANIZING COMMITTEE: General Chair - Renee Parente, AMD Vice General Chair - Kristofor Dickson, NXP Technical Program Chair - Ted Kolasa, Northrop Grumman Tutorial & Short Course Chairs - Erwin Hendarto, Silicon Labs, and Daminda Dahanayaka, IBM Panel Discussion Chairs – Wentao Qin, Microchip, and Greg Johnson, Zeiss User Group Chairs - Anita Madan, Independent Consultant, Cecile Bonifacio, E.A. Fischione Instruments Inc., and Jayant D’Souza, Siemens Roadmap Chair - Vinod Narang, AMD, and Keith Serrels, Hamamatsu Corp. Exposition Chairs - Sebastian Brand, Fraunhofer IMWS, and Chris Richardson, Allied High Tech Products Inc. Movie Chair - Peng Li, Intel Corp. AV Chairs - Rose Ring, NenoVision, and Chuan Zhang, Nvidia International Chairs - Rose Ring, NenoVision, and Dayanand Nagalingam, GlobalFoundries University Chair - Umberto Celano, Arizona State University Local Arrangements Chair - Seraina Murphy, The Aerospace Corp. Past Conference Chair - Yan Li, Samsung I am deeply grateful to the organizing committee, volunteers, and ASM International staff whose dedication made ISTFA 2025 a success. Together, we are shaping the future of our field. Let us continue to engage, empower, and expand— ensuring that failure analysis remains at the forefront of technological progress. ISTFA SPONSORS & SUPPORTERS On behalf of the Electronic Device Failure Analysis Society (EDFAS) and the organizers of ISTFA 2025, we appreciate your generous sponsorship contribution and recognize your continued commitment in making the ISTFA Conference and Exposition an outstanding event! Corporate Sponsor Thermo Fisher Scientific Sponsors Allied High Tech Products Inc. American Elements BSET EQ Supporters DC – Digit Concept JIACO Instruments Nanoscience Instruments Neocera Magma Media Sponsor EDFA Magazine Quartz SELA Siemens Ted Pella Inc. Tescan ULTRA TEC Zeiss
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