edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 1 22 As I reflect on the 51st International Symposium for Testing and Failure Analysis (ISTFA), held last November in Pasadena, I distinctly recall the sense of optimism and resolution that permeated every tutorial, technical session, coffee chat, keynote, and networking event. Our theme, “Scaling Beyond Moore’s Law: Heterogeneous Computing and Advanced Packaging,” was not just a slogan, but a declaration of how the Electronics Device Failure Analysis Society (EDFAS) is coming together to meet the profound changes reshaping microelectronics and corresponding failure analysis head on. A COMMUNITY AT AN INFLECTION POINT The relentless drive for higher performance, greater integration, and new architectures is pushing the boundaries of what is possible in device design and manufacturing. With each development—be it in advanced packaging, high-bandwidth I/O, or heterogeneous compute architectures—we encounter new analytical challenges that demand innovative thinking and new tool capabilities. The disruption is real, and so is EDFAS’ resolve. ISTFA 2025 AND THE NEXT ERA OF FAILURE ANALYSIS Renee S. Parente, ISTFA 2025 Conference Chair AMD renee.parente@amd.com ISTFA 2025, with 715 attendees from 20 different countries, was a testament to this spirit. The technical program, expertly curated by Ted Kolasa and our organizing committee, showcased novel techniques and practical solutions across the failure analysis field. The 138 presentations were not only technically rigorous but also forward-looking, highlighting the need for industry-wide collaboration and the development of new methodologies. HIGHLIGHTS AND INSPIRATION Our keynote speakers echoed the tone for the week. Dr. Liwei Wang, Senior Director of Heterogeneous Integra- tion Foundry Technology Development at AMD, explored the “Future of AI Hardware Enabled by Advanced Packaging,” offering a vision of how advanced integration will power the next generation of artificial intelligence. Steven Herschbein, formerly of IBM/GlobalFoundries, spoke on “The CHIPS Act and its Impact on the U.S. Semiconductor Industry, the Overall Economy, and Analytical Labs.” His talk highlighted the growing connection between policy and technology, emphasizing that our efforts reach far beyond the failure analysis labs—including the oftenignored connection between successful FA and process The ISTFA 2025 organizing committee.
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