edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 1 10 Saxony LLC & Co. KG, Dresden, Germany, from 2001 to 2004, working on physical failure analysis and process development support, as well as TEM characterization method development. Since 2004, he has been an application expert and advisor at Carl Zeiss Microscopy GmbH, Oberkochen, Germany, with emphasis on characterization of nanostructures for failure analysis and manufacturing process development, using techniques such as SEM, FIB, STEM, EDX, FIB-SIMS, and working on the company’s continuous improvement efforts. Daniel Plencner is a computer vision scientist in Corporate Research & Technology at Zeiss. He develops algorithms for 3D volumetric and surface data, covering anomaly detection, segmentation, and registration. Before joining Zeiss, he worked on 3D computer vision at ZF Group. Plencner holds a Ph.D. in physics from LMU Munich and conducted post-doctoral research at Sorbonne University and École Normale Supérieure in Paris. Roland Salzer received his diploma in physics at the University of Leipzig in 2006. From 2007 to 2011, he worked as research assistant at the IWM in Halle focusing on the improvement of FIB-SEM microscope application and workflows. In 2011, he joined Carl Zeiss Microscopy GmbH as an applications specialist for crossbeams and in 2013 he became the product manager for electron microscopy control software. In 2016, Salzer joined Sinus Messtechnik GmbH as the assistant manager responsible for national and international sales activities, product developments and certifications, HR, and production. In 2019, he rejoined Zeiss as a Solution/External Product Manager for electron microscopes at Industrial Quality Solutions. Since 2021, he has been the team leader at the Software Solutions Lab EM at Carl Zeiss Microscopy GmbH providing customized software solutions for electron microscopes and crossbeams focusing on the automation of complex workflows. NOTEWORTHY NEWS IRPS 2026 The IEEE International Reliability Physics Symposium’s (IRPS) annual conference will be held March 22-26 in Tucson, Ariz. The IRPS technical program includes technical sessions, keynotes, and invited talks on emerging issues, tutorials, workshops, poster sessions, a year-in-review seminar, and equipment demonstrations. IRPS 2026 is soliciting increased participation in the following areas: new materials, 3D packaging and heterogeneous integration, data center reliability, and more. The IRPS Conference is sponsored by the IEEE Reliability Society and IEEE Electron Devices Society. For more information, visit the IRPS website at irps.org. FIB SEM MEETING 2026 The 18th annual FIB SEM Meeting, to be held April 8-9, at the Kossiakoff Center at Johns Hopkins Applied Physics Laboratory in Laurel, Md. The 2026 FIB SEM will feature presentations, tutorials, and posters by FIB users and vendors, highlighting new applications and the latest technology. The event offers plenty of technical content as well as opportunities for informal discussions with FIB colleagues. Continuing this year will be student awards for best oral and poster presentations. Abstract submission deadline is March 1. For more information, visit fibsem.net or email keana.scott@nist.gov.
RkJQdWJsaXNoZXIy MTYyMzk3NQ==