edfas.org 1 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 1 ABOUT THE COVER The image shows a burning event that looks like a flaming horse created by simulating the customer reported failure on a board-level product through mechanically damaging a surface-mount capacitor and powering up the module with high supply current limit. Photo by Ruel Angelo Agpaoa, Analog Devices Inc., First Place Winner in Color Images, 2025 EDFAS Photo Contest. A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS FEBRUARY 2026 | VOLUME 28 | ISSUE 1 edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS DEPARTMENTS Advanced Semiconductor Failure Analysis using In-Situ AFM in FIB-SEM Radek Dao, Ondřej Novotný, Veronika Hegrová, Rosalinda Ring, and Jan Neuman To address the limitations of traditional workflows, this work introduces a correlative, in-situ methodology that integrates atomic force microscopy directly into the vacuum chamber of a scanning electron microscope or focused ion beam. Author Guidelines Author guidelines and a sample article are available at edfas. org. Consult the guidelines prior to manuscript preparation. 3 11 2 GUEST EDITORIAL Ingrid De Wolf 28 ISTFA PANEL & USER GROUP SUMMARY 35 WEFA 2025 ISTFA SESSION WRAP 37 SILICON VALLEY FA WORKSHOPS SUMMARY 39 2025 EDFAS AWARD WINNERS 40 2026 EDFAS AWARDS 41 BOARD OF DIRECTORS NEWS Chris Richardson 42 CALL FOR NOMINATIONS Felix Beaudoin 43 DIRECTORY OF FA PROVIDERS Rosalinda Ring 45 LITERATURE REVIEW Michael R. Bruce 46 PRODUCT NEWS Ted Kolasa 48 TRAINING CALENDAR Rosalinda Ring 50 GUEST COLUMN Lun Chan and Phil Kaszuba 52 ADVERTISERS INDEX Enhancing Soft Defect Localization with SAILS and Array-based Image Reconstruction Arun Karunanithi, Benny Hsu, Kent Erington, Joseph Caroselli, Winston Gao, Calder Wilson, and Aaron Liao This article shows the successful implementation of software automated intelligent laser scanning (SAILS) and shows its ability to judiciously mask out sites in real-time and use this mask to modulate laser dwell time. 16 For the digital edition, log in to edfas.org, click on the “News & Magazines” tab, and select “EDFA Magazine.” A Step Toward Automation in Failure Analysis by FIB-SEM 3D Tomography and AI Segmentation Pascal Limbecker, Rong Wu, Thomas Woyack, Heiko Stegmann, Daniel Plencner, and Roland Salzer This article looks at ways to automate FIB-SEM slice and view, dataset post-processing and visualization, and automated defect detection. 11 3 22 16 ISTFA 2025 Highlights A recap of the ISTFA 2025 event includes General Chair Renee S. Parente’s wrap-up as well as a list of the winning ISTFA papers and posters. 22
RkJQdWJsaXNoZXIy MTYyMzk3NQ==