edfas.org 55 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 4 automated approach that leverages supervised machine learning for defect detection. The aim is to address challenges such as the lack of quantitative information in model outputs, high memory consumption with highresolution images and deep neural networks, lacking training data, and issues related to task transferability in real-world automatic defect detection scenarios. To illustrate the proposed method, x-ray printed circuit board (PCB) images are employed to assess the void percentage in its integrated circuits (ICs), which is a key measure of the quality of PCB assembly. The methodology utilizes end-to-end segmentation models to identify pixels corresponding to void and IC regions in x-ray PCB images, enhancing defect detection precision. Is it your first time attending an ISTFA conference? What draws you to the conference? What is your favorite thing about the ISTFA conference? This is my first time attending the ISTFA conference. I became aware of ISTFA through the EDFAS Student and Young Professional (SYP) Committee while working on a project focused on electrical device defect detection. Eager to explore state-of-the-art methods for failure analysis, I decided to participate in ISTFA 2024 to deepen my understanding of the industry. Attending the conference was a fantastic experience. I gained valuable insights into the latest technologies and techniques in failure analysis, which will greatly enhance my work. Engaging with experts and networking with peers has inspired me to apply these innovations in my own projects. Second Place Winner (tied): Kyle Wang, undergraduate student, University of Virginia Poster Title: Crystallographic Etching using Molten FLiNak Salts Abstract: Molten eutectic LiFNaF-KF (FLiNak) salt is typically used as a medium for corrosion testing for molten salt nuclear reactor application. In this work, we observed specific corrosive conditions in which pure metal (e.g., Ni, Cr) exhibit micron-scale faceted surfaces at 600°C. Using electron backscatter diffraction (EBSD) coupled with scanning electron microscopy (SEM) and crystallography modeling, we relate specific faceted surfaces to their parent crystallographic orientations. Based on this observation, the possibility and implication of using FLiNaK as a possible etchant is discussed. Is it your first time attending an ISTFA conference? What draws you to the conference? What is your favorite thing about the ISTFA conference? Yes, this is my first time! I really wanted to find a job in the microelectronics industry. My passion in materials science and engineering and microelectronics makes me realize that FA may be a career path for me, and therefore I came to the ISTFA conference. I loved how friendly everyone was, how patient when answering my different kinds of questions. Third Place Winner: Ondřej Novotný, development engineer, NenoVision s.r.o. Poster Title: Site-Specific Semiconductor Failure Analysis using AFM-in-SEM Solution Abstract: The semiconductor industry is continuously pushing device performance, and the development of new methodologies and instrumentation is the key to the success. Proper understanding of electrical connections, failures at the micro-scale level, or dopant concentrations, etc. are fundamental aspects for enhanced device quality, performance, and longevity. As SEM is widely used in semiconductor research, we have developed a workflow for analyzing electrical properties using atomic force microscopy (AFM) within the SEM. By integrating these two techniques, it is possible to analyze various properties at specific sites while significantly reducing risks of sample and probe damage. Using AFM-in-SEM, it is possible to lift-out, bulk crosssection, or delayer the sample surface to examine the inner structure. We used focused ion beam (FIB) to delayer individual layers of a 3D NAND structure and further in-situ analyzed local conductivity. The results show that this setup reveals potential failures within the vias. Is it your first time attending an ISTFA conference? What draws you to the conference? What is your favorite thing about the ISTFA conference? Yes, first time attendance. I was drawn by news in application and development field related to the semiconductor business. My favorite thing is the information density and relevance.
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