edfas.org 53 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 4 IRFA’s Mission: 1. Identify key gaps, challenges, and technological needs for the FA of both current and next-generation electronic devices. 2. Influence industry, scientific equipment manufacturers, research institutes, and universities to co-develop innovative solutions and strategies for the identified gaps. 3. Elevate global EDFA awareness by participating in conferences, workshops, and collaborative forums, share knowledge, and foster dialogue within the broader semiconductor community. 4. Advocate for strategic investments in EDFA R&D and actively influence global policy and funding initiatives to strengthen semiconductor developments. 5. Deliver actionable roadmaps that guide EDFA stakeholders in building robust capabilities and addressing future challenges. EVOLVING ORGANIZATIONAL STRUCTURE With its renewed identity came key updates to leadership and structure. In 2024, Vinod Narang (AMD) succeeded Keith Serrels (Hamamatsu) as IRFA Chair, following a carefully planned transition. Domain leadership also evolved: The Isolation Domain Chairs transitioned from Szu Huat Goh (Qualcomm) and Lesly Endrinal (Google) to VenkatKrishnan Ravikumar (AMD) and Kristofor Dickson (NXP); the Post-Isolation Domain Chairs from Vinod Narang and Chuan Zhang (Nvidia) to Baohua Niu (Intel) and Jane Li (Nvidia); and in the Packaging Innovation Roadmap Council (PIRC) Christian Schmidt (Nvidia) will retire and Peng Li (Intel) joins Yan Li (Samsung) who will remain as a PIRC Chair. We extend a big thank you to the new Council Chairs and express deep appreciation for the outgoing leaders. The Councils execute the IRFA roadmap, making strong leadership essential for advancing the IRFA mission. The IRFA leadership team, including Keith Serrels, Felix Beaudoin (GlobalFoundries), Ryan Ross (Intel), David Su (Consultant), and Vinod Narang, remain intact to ensure continuity. A major improvement was the formation of the Failure Analysis Outreach Council (FAOC), chaired by Keith Serrels. FAOC was created to expand IRFA’s visibility, foster deeper industry engagement, and support government funding proposals aligned with initiatives like the CHIPS Act. FAOC also drives outreach activities to highlight the critical role of EDFA in the future of semiconductor technology. Further strengthening its approach, IRFA integrated the Failure Analysis Future Council (FAFRC) into its Die-Level and Packaging Innovation Councils. This structural shift ensures a more seamless view of challenges and solutions—spanning the entire EDFA process from early-stage design to final packaging and assembly. For the first time, scientific equipment manufacturers have also been added to council representation. Their inclusion offers broader industry perspectives, enhances gap identification, and aligns IRFA with best practices from other global roadmap initiatives. The updated IRFA organization structure is presented in Fig 1. THANK YOU TO OUR GLOBAL VOLUNTEERS IRFA’s success is powered by its dedicated volunteer community—over 50 global experts representing more than 30 companies including fabless, foundries, IDMs, memory, specialty devices, universities, and research institutes. Their contributions of time, expertise, and passion drive this effort forward. On behalf of EDFAS and the IRFA leadership team, we extend sincere gratitude to every volunteer whose commitment is shaping the future of EDFA. A CALL TO ACTION FOR THE FA COMMUNITY IRFA is not merely a document—it is a living, evolving tool designed to serve the global EDFA community. Your involvement is essential to its success. We invite you to: • Explore and apply the roadmap in your research, development, and planning efforts. • Share your feedback to ensure the roadmap reflects emerging industry needs. • Volunteer your expertise and join a worldwide network committed to advancing failure analysis. • Participate in outreach activities that raise awareness of FA’s pivotal role in semiconductor progress. Your voice matters. Whether you are an engineer, scientist, academic, or policymaker, your insights can shape the direction of this roadmap—and the future of semiconductor reliability itself. In summary, IRFA offers a structured, forward-looking roadmap designed to highlight critical technical gaps, foster collaboration, and promote strategic investment in EDFA research and infrastructure. IRFA unites experts from industry, academia, and government, creating a platform to collectively address challenges and shape practical solutions for the future. Together, through collaboration, innovation, and shared purpose, we can drive the future of failure analysis and safeguard the strength, resilience, and advancement of the global semiconductor industry.
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