edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 4 52 GUEST COLUMN INTERNATIONAL ROADMAP FOR FAILURE ANALYSIS Vinod Narang, AMD Singapore narang.vinod@amd.com Electronic device failure analysis (EDFA) has be- come a cornerstone of semiconductor technology innovation, providing critical insights that drive progress across the microelectronics industry. Recognizing the growing importance of EDFA, ASM International’s Electronic Device Failure Analysis Society (EDFAS) established the FA Technology Roadmap Committee in 2020. The goal: to identify key challenges and solutions across the EDFA landscape. As process technologies shrink to sub-3nm nodes, device architectures diversify, and packaging complexity explodes, EDFA has become essential—not only to resolve technical issues but also to guide design improvements, boost yields, and enhance overall device reliability and performance. A NEW NAME, A STRONGER GLOBAL IDENTITY As part of its growth and expanding scope, the FA Technology Roadmap was renamed the International Roadmap for Failure Analysis (IRFA). This change reflects its global reach and collaboration with respected organiza- tions such as IEEE, SRC, and NIST. The new name signifies more than rebranding—it marks IRFA’s rising influence as a trusted global resource for the semiconduc- tor community. To accompany this transformation, IRFA introduced a new logo symbolizing global cooperation, technological progress, and a lasting commitment to advancing failure analysis across the microelectronics industry. OUR MISSION AND VISION To achieve a cohesive and unified approach, the IRFA leadership team has established a clear vision and mission. This clarity helps to stay aligned with core values and objectives. By fostering enhanced collaboration and effectively communicating our goals to stakeholders and interested parties, we aim to institutionalize the initiative successfully. Our vision: To be the leading international authority in electronic device failure analysis for proactively identifying the evolving technology challenges and gaps and influencing potential solutions to advance the semiconductor industry. Fig. 1 IRFA Council Structure for 2025-2026
RkJQdWJsaXNoZXIy MTYyMzk3NQ==