edfas.org 49 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 4 management markets, featured a range of sustainable, high-reliability solder products at Productronica India, held September 17-19 in Bengaluru, India. The company’s solder and alloy technologies are designed to meet the stringent requirements of the EV market, where thermal management, reliability, and energy efficiency are paramount. The ability to enhance thermal cycling performance and reduce energy consumption aligns with industry’s drive towards sustainability and longer-lasting products. Durafuse HR, a trusted and proven solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength. Durafuse LT is a solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and lowtemperature step soldering. It is ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse LT delivers superior thermal cycling and drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and it even outperforms SAC305 with optimal process setup. Indalloy 303, or Bi+, is an innovative low-temperature solder developed to meet the challenges of modern electronics manufacturing. Featuring a unique doped bismuth composition, Bi+ delivers outstanding reliability and performance for sensitive components that demand precise thermal management. InFORMS are reinforced solder preforms that improve mechanical strength and produce consistent bondline thickness for superior reliability performance compared to traditional solder preforms, particularly in power module applications. For more information, visit indium.com. PRECISION POLISHING FOR TEM SPECIMEN THINNING The PELCO Dimpler is the latest model in the evolution of the Dimpler line formerly available from South Bay Technology. It provides automated precision thinning of specimens for TEM analysis, for deprocessing and failure analysis, and similar applications where targeted fine polishing is required. It is a precision electro-mechanical metallographic lapping instrument that will continuously monitor and control dimpling parameters and accurately terminate at a preset specimen thickness. This electronic and mechanical integration has added repeatability and reliability to the dimpling process, as well as automation. Durafuse HR is designed for high-reliability automotive applications. Active monitoring of the Z-position, feedback- controlled damping, and automated controls for determining termination of processing work together to provide repeatable, reliable results in sample preparation. For more information, visit tedpella.com. PELCO Dimpler polishing system. Advertise in Electronic Device Failure Analysis magazine! For information about advertising in Electronic Device Failure Analysis: KJ Johanns, Business Development Manager 440.671.3851, kj.johanns@asminternational.org Current rate card may be viewed online at asminternational.org/advertise.
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