edfas.org 43 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 4 JP ANALYTICAL 680 N. Glenville Dr. Richardson, TX 75081 580.319.8198 info@jpanalytical.com jpanalytical.com Services Offered: R&D partner and analytical service provider, materials and thin-film analysis, and R&D solutions to surface science projects. Tools and Techniques: 2.5 MV Van de Graaff accelerator, accelerator-based ion bean analysis techniques including Rutherford backscattering (RBS), hydrogen forward scattering (HFS/ERDA), nuclear reaction analysis (NRA), particle induced x-ray emission (PIXE), positron annihilation lifetime spectroscopy (PALS), XRF, AFM, XPS, Hall probe, and 4-point probe. MIMOS BERHAD Technology Park Malaysia Bukit Jalil, 57000 Kuala Lumpur, Malaysia +603.8995.5000 info@mimos.my mimos.my/failure-analysis Services Offered: Failure analysis, electrical verification, fault localization, nondestructive inspection, material analysis, and physical analysis. Tools and Techniques: Logic and high voltage curve tracer, real-time x-ray (x-ray) 2D inspection tool, 3D x-ray 3D inspection tool, scanning acoustic microscope (SAM) inspection, fault localization, photon emission microscope (PEM) and optical beam induced resistance change (OBIRCH) fault localization system, thermal emission microscope fault localization system, current imaging (MCI) fault localization system, laser and chemical decapsulator package opening, confocal and digital microscopes visual inspection tool, dual-beam (FIB and FESEM) high resolution inspection system, field emission gun scanning electron microscope (FESEM), material analysis, auger electron spectroscopy (AES), TOF secondary ion mass spectroscopy (ToF-SIMS), x-ray photoelectron spectroscopy (XPS), TEM upgrades with electron energy loss spectroscopy (EELS), Fourier transform infrared spectroscopy (FTIR), ultraviolet-visible and infrared spectroscopy (UV-Vis-IR), inductively coupled plasma mass spectrometry (ICP-MS), gas chromatography-mass spectroscopy (GC-MS/MS), and nanoindentation. MSSCORPS CO. LTD. 639 N. Pastoria Ave. Sunnyvale, CA 94085 408.685.2080 mike_chen@msscorps.com en.msscorps.com Services Offered: Materials analysis, IC circuit repair, failure analysis, and chemical engineering analysis. Tools and Techniques: TEM/EDS, DB FIB/EDS, SEM/EDS, 3D laser confocal profile, AFM, FTIR, XPS, SIMS, CP, CEF, plasma FIB, liquid TEM, TLP, THz-TDR, thermal EMMI (InSb), nano prober system, EMMI/InGaAs, OBIRCH, 2D 3D x-ray, 3D OM, SAT, laser decap, and delayer. NANOWATTS TECHNOLOGIES PVT LTD. 80 Feet R., RMV 2nd Stage Ashwath Nagar, Armane Nagar Bengaluru, Karnataka, India +91.82176.18041 info@nanowattstech.com nanowattstech.com Services Offered: Nano fabrication and foundry services, process integration services, low volume prototyping, material characterization, semiconductor IC testing, materials testing lab, electronics testing lab, nano bio tech electron microscopy lab, x ray inspection facility, polymer rubber test lab, mechanical testing lab, consumer testing lab, IC failure analysis lab, spectrophotometer lab, and XRF testing lab. Tools and Techniques: Semiconductor device and parameter analyzer, impedance capacitance analyzer for high frequency and quasi static measurements, mobile ion CV and hall mobility analyzer, RF probe station, solar simulator and QE, lifetime PV measurements, transient and pulsed measurements, elevated temperature dependent electrical testing, breakdown voltage testing, electronic material dielectric and insulation testing, low temperature probe station, superconductor material electromagnetic probe station, RF CMOS, MMIC, RF antenna and analog testing, SEM, FIB, TEM, AFM, confocal laser microscope, FIB, confocal laser scanning microscope, XRD, FTIR, NMR, and Raman spectroscopy. UTAC HEADQUARTERS PTE. LTD. 22 Ang Mo Kio Industrial Park 2 Singapore 569506 +65.6481.8811 utacgroup.com Services Offered: Design services, package characterization, reliability services, failure analysis services, IC package failure analysis, and PCB board failure analysis. Tools and Techniques: Focus ion beam (FIB), transmission electron microscopy (TEM), x-ray radiography and SAM, IR microscopy, x-ray imaging, curve tracing, decapsulation, delayering, cross-sectioning, scanning electron microscopy, energy dispersive x-ray spectroscopy (EDS/ EDX), Fourier transform infrared spectroscopy (FTIR), x-ray photoelectron spectroscopy (XPS), time-of-flight secondary ion mass spectrometry (ToF-SIMS), and auger electron spectroscopy (AES).
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