edfas.org 39 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 4 PARK SYSTEMS BOOTH 205 TED PELLA INC. Ted Pella Inc. announces the PELCO Dimpler provides automated precision thinning of specimens for TEM Analysis, for deprocessing and failure analysis, and similar applications where targeted fine polishing is required. It is a precision electro-mechanical metallographic lapping instrument that will continuously monitor and control dimpling parameters and accurately terminate at a preset specimen thickness. Active monitoring of the Z-position, feedback-controlled damping, and automated controls for determining termination of processing work together to provide repeatable, reliable results in sample preparation. tedpella.com/Material-Sciences_html/ PELCO-Dimpler.aspx BOOTH 711 ULTRA TEC ULTRA TEC’s ULTRAPOL Advance is the leading allin-one lapping and polishing workstation for the production of flat surfaces. A combination of advanced control and process features allow for the accurate processing of modern ICs through topside electronic deprocessing— enabled by the advanced optical enhancements such as our ULTRACOLLIMATOR. Applications include backside preparation of packages and wafers, particularly for flipchips—and rapid global thinning of larger surfaces. The ULTRAPOL Advance offers cross-sectioning of die and package-level devices. ultratecusa.com BOOTH 519 ZEISS ZEISS helps you achieve faster insights and overcome semiconductor challenges with advanced microscopy solutions for failure analysis and characterization. From wafer fab to packaging, our high-resolution light, X-ray, electron, and ion beam technologies provide actionable information to drive innovation and ensure success in next-generation device development. Empower your analysis with tools designed to meet your toughest demands. zeiss.com/ semiconductor-microscopy BOOTH 619 Park Systems offers advanced tools for semiconductor failure analysis, including AFM for high-resolution imaging of wafers. The Imaging Spectroscopic Ellipsometer (ISE) provides precise thin film characterization, while Digital Holographic Microscopy (DHM) enables fast, non-invasive 3D inspection of defects and process variations. parksystems.com Westin Courtyard Plaza. Pasadena Cityscape.
RkJQdWJsaXNoZXIy MTYyMzk3NQ==