edfas.org 35 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 4 EDFAS MEMBERS RECEIVE ASM AWARDS The Electronic Device Failure Analysis Society (EDFAS) is proud to announce that three of its members have been named as recipients of 2025 ASM Awards. ASM FELLOWS Nicholas Antoniou, FASM, senior product manager, KLA Corp., Milpitas, Calif., was named to the 2025 Class of Fellows of ASM International. He was cited “for pioneering focused ion beam circuit editing, cryogenic FIB-SEM innovations, and quantitative sMIM methodologies that have transformed semiconductor metrology and accelerated product innovation.” Prof. Ingrid De Wolf, FASM, Imec/KU Leuven, Leuven, Belgium, was named to the 2025 Class of Fellows of ASM International. She was cited “for pioneering research and development in the fields of microelectronic reliability, failure analysis, and Raman spectroscopy, which have enabled innovative nanoelectronics solutions.” Antoniou and De Wolf join Larry Wagner (2010), Ed Cole (2013), Bill Vanderlinde (2014), Lee Knauss (2016), Philippe Perdu (2016), Cheryl Hartfield (2017), Dehua Yang (2018), Felix Beaudoin (2019), Richard McSwain (2019), Janez Grum (2020), Virginia Osterman (2020), Michael Pecht (2020), James Demarest (2021), Philip Kazuba (2021), Frank Stellari (2022), Christian Boit (2023), Jeremy A. Walraven (2023), Ryan Ross (2024), and Zhigang Song (2024) as EDFAS members selected for this honor. ASM INTERNATIONAL OUTSTANDING GRADUATE SCHOLAR AWARD We are thrilled to announce the inaugural recipient of the Outstanding Graduate Scholar Award, Dr. Ho Lun Chan, University of Virginia, Charlottesville. This is a new recognition for graduate students who have shown outstanding scholarly performance in the field of metallurgy/materials science and engineering and related careers. Antoniou De Wolf Chan NOTEWORTHY NEWS IRPS 2026 The IEEE International Reliability Physics Symposium’s (IRPS) annual conference will be held March 22-26 in Tucson, Ariz. The IRPS technical program includes technical sessions, keynotes and invited talks on emerging issues, tutorials, workshops, poster sessions, a year-in-review seminar, and equipment demonstrations. IRPS 2026 is soliciting increased participation in the following areas: new materials, 3D packaging and heterogeneous integration, data center reliability, and more. The IRPS Conference is sponsored by the IEEE Reliability Society and IEEE Electron Devices Society. For more information, visit the IRPS website at irps.org.
RkJQdWJsaXNoZXIy MTYyMzk3NQ==