edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 4 32 The CAM Workshop was held at the Fraunhofer Institute for Microstructure of Materials and Systems IMWS in Halle (Saale), Germany on May 20-21, 2025. The workshop highlighted the critical role of efficient failure analysis in advancing high-performance electronics and strengthening the European semiconductor industry. More than 150 international participants explored topics including gallium nitride (GaN) power devices, microelectromechanical system (MEMS) sensors, and the APECS pilot line for advanced packaging and integration. Fraunhofer IMWS business unit head Frank Altmann emphasized the workshop’s value as an international platform for exchanging insights on defect detection, material characterization, and quality assurance. Presentations showcased progress in defect localization, case studies of troubleshooting workflows, and novel material analysis methods. Keynotes included Infineon’s Thomas Detzel on GaN applications; STMicroelectronics’ Mikel Azpeitia Urquia on MEMS sensors for AI; and imec’s Ingrid de Wolf on mechanical stress and reliability. AI applications in failure analysis were addressed by Konstantin Schekotihin from the University of Klagenfurt. A major highlight was Ulrike Ganesh’s presentation on the APECS pilot line, part of the EU Chips Act, which supports chiplet technologies, heterogeneous integration, and scalable manufacturing. The initiative involves ten partners from the Research Fab Microelectronics Germany (FMD) and aims to accelerate Europe’s semiconductor capabilities. Now in its twelfth edition, the CAM Workshop reaffirmed its status as a key international forum for advancing diagnostics, reliability, and innovation in microelectronics failure analysis. The 13th CAM Workshop will again be held in Halle (Saale), Germany, on May 19-20, 2026. “PRESENTATIONS SHOWCASED PROGRESS IN DEFECT LOCALIZATION, CASE STUDIES OF TROUBLESHOOTING WORKFLOWS, AND NOVEL MATERIAL ANALYSIS METHODS.” CAM WORKSHOP SUMMARY CAM WORKSHOP: NEW APPROACHES FOR FAILURE ANALYSIS AND MATERIAL DIAGNOSTICS OF ELECTRONIC COMPONENTS Michael DiBattista, Varioscale Inc. miked@varioscale.com Advertise in Electronic Device Failure Analysis magazine! For information about advertising in Electronic Device Failure Analysis: KJ Johanns, Business Development Manager 440.671.3851, kj.johanns@asminternational.org Current rate card may be viewed online at asminternational.org/advertise.
RkJQdWJsaXNoZXIy MTYyMzk3NQ==