edfas.org 11 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 4 for Three-Dimensional Analysis of Four-Dimensional NAND Flash Memory,” Proceedings of the ISTFA2024, 2024, p. 327-331. 18. D. Kendig: “Thermal Imaging Based on Thermoreflectance Ad- dressing the Challenges for Thermal Analysis of Today’s Advanced Complex Devices,” ICEPT, 2016. 19. K. Endo, et al.: “Thermal Behavior Analysis of Interconnect Structures of Si Semiconductor Devices using the Temperature Dependent Reflectance of an Incoherent Light Beam,” Jpn. J. Appl. Phys., 54, 2018, 07ME02. 20. S. Tominaga, et al.: “Application of Visible ThermoDynamic Imaging Technology for Hotspot Detection in Failure Analysis,” Proceedings of the ISTFA2024, 2024, p. 242-247. 21. TPSX Material Properties Database, Silicon. 22. TPSX Material Properties Database, Silicon Oxide. ABOUT THE AUTHORS Norimichi Chinone received a doctor of engineering degree from Tohoku University, Japan, in 2017. After graduation, he started working at Hamamatsu Photonics for R&D on the failure analysis microscope system, PHEMOS. Since 2023 he has worked at Hamamatsu Corp. in the USA as an application engineer for PHEMOS. His research interest includes OBIRCH, time-resolved emission, and magnetic field imaging. Shimpei Tominaga received his bachelor’s degree in science from Shinshu University. He joined Hamamatsu Photonics K.K. in 2017 as an application engineer of semiconductor failure analysis. Since 2022, he has been in the R&D Group System Technology Systems Division to develop failure analysis equipment. He focuses on failure analysis for advanced devices such as BS-PDN where active layer is sandwiched by signal metal layers and power metal layers. Tominaga has been a speaker at several semiconductor conferences (ISTFA, CAM Workshop, etc.) and coauthored several articles and patents. EDFAS members enjoy these benefits: • Subscription to the Electronic Device Failure Analysis (EDFA) magazine • Subscription to the EDFA eNews • Online access to EDFA magazine articles • Online access to the Journal of Failure Analysis and Prevention (JFAP) • Online access to the 7th Edition Microelectronic Failure Analysis Desk Reference • Online access to all International Symposium for Testing and Failure Analysis (ISTFA) proceedings • Access to the EDFAS Membership Directory • Discount on registration for the annual ISTFA Conference and Exposition EDFAS, the Electronic Device Failure Analysis Society, focuses specifically on the reliability, testing, and failures of circuits, semiconductors, and other electronics platforms. SHAPE THE FUTURE OF YOUR CAREER FOR MORE INFORMATION: memberservicecenter@asminternational.org 440.671.3800 JOIN ONLINE: EDFAS.ORG
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