edfas.org 1 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 4 ABOUT THE COVER See page 45 for a description of the contest images collage on the cover. A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS NOVEMBER 2025 | VOLUME 27 | ISSUE 4 edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS DEPARTMENTS Avoiding SEM-induced Device Degradation Through Semi-blind Nanoprobing Marc Heinemann and Markus Reichel A semi-blind probe positioning approach effectively avoids beam-induced degradation by reducing the number of SEM images required. Author Guidelines Author guidelines and a sample article are available at edfas. org. Potential authors should consult the guidelines for useful information prior to manuscript preparation. 4 14 2 GUEST EDITORIAL Raja Swaminathan 32 CAM WORKSHOP SUMMARY Michael DiBattista 34 EDFAS AWARDS 35 ASM AWARDS 36 CALL FOR PAPERS 37 ISTFA 2025 EXHIBITORS LIST 38 ISTFA 2025 EXHIBITOR SHOWCASE 40 BOARD CANDIDATE PROFILES Felix Beaudoin 42 DIRECTORY OF FA PROVIDERS Rosalinda Ring 44 EDUCATION NEWS Navid Asadi 45 ABOUT THE COVER 46 LITERATURE REVIEW Michael R. Bruce 48 PRODUCT NEWS Ted Kolasa 50 TRAINING CALENDAR Rosalinda Ring 52 GUEST COLUMN Vinod Narang 54 GUEST COLUMN Lun Chan 56 ADVERTISERS INDEX Toward a Failure Analysis Chatbot with Retrieval-augmented Generation Maik Fichtenkamm, Markus Kofler, Konstantin Schekotihin, and Christian Burmer This article looks at naive, advanced, and modular retrievalaugmented generation architectures for an FA chatbot implementation. 22 For the digital edition, log in to edfas.org, click on the “News & Magazines” tab, and select “EDFA Magazine.” Innovative Thermal Approaches to Fault Isolation in Three-dimensional Semiconductor Structures Norimichi Chinone and Shimpei Tominaga Optical fault isolation techniques relying on heat diffusion, including thermo-reflectance and lock-in OBIRCH, are applied to relatively thin 3D devices as proof-of-concept test samples for FA applications. 14 4 22
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