edfas.org 41 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 3 Micropipes in Silicon Carbide using Mirror Electron Microscope,” J. Appl. Phys., 2023, 134, p. 195701. • I. Makkonen and F. Tuomisto: “Perspective on Defect Characterization in Semiconductors by Positron Annihilation Spectroscopy,” J. Appl. Phys., 2024, 135, p. 040901. • L. Mo, Q. Yu, Z. Hu, et al.: “Single Event Burnout of SiC MOSFET Induced by Atmospheric Neutrons,” Microelectron. Reliab., 2023, 146, p. 114997. • P.T. Ng, F. Rivai, A.C.T. Quah, et al.: “Enhanced EBAC Localization of Gate Oxide Defects after High Voltage Electron Beam Irradiation,” Microelectron. Reliab., 2023, 147, p. 115074. • A.S. Palau, S.D. Eder, G. Bracco, et al.: “[Review:] Neutral Helium Atom Microscopy,” Ultramicroscopy, 2023, 251, p. 113753. • S.B. Vasco, N. Baier, C. Lobre, et al.: “Use of Electron Beam-Induced Current Technique to Characterize Transport Properties of Narrow-Gap-Energy Materials for IR Detection,” J. Electron. Mater., 2024, 53, p. 5850. • K. Xu, H. Zeng, K. Zhao, et al.: “Nanoscale Subsurface Imaging by Non-steady-state Electron Beam-driven Scanning Thermoelectric Capacitance Microscopy [(STeCM)],” Appl. Phys. Lett., 2024, 125, p. 103503. • W. Zhao, Q. Mo, L. Zheng, et al.: “[Reviews:] High-precision X-ray Characterization for Basic Materials in Modern High-end Integrated Circuit,” J. Semicond., 2024, 45, p. 071101. • S. Zheng, J. Yang, M. Du, et al.: “Influence of Electron Beam Irradiation Induced Charging-effect on Nanoprobing Localization of a Crystal Defect in MOSFET,” Microelectron. Reliab., 2023, 151, p. 115262. EDFAS members enjoy these benefits: • Subscription to the Electronic Device Failure Analysis (EDFA) magazine • Subscription to the EDFA eNews • Online access to EDFA magazine articles • Online access to the Journal of Failure Analysis and Prevention (JFAP) • Online access to the 7th Edition Microelectronic Failure Analysis Desk Reference • Online access to all International Symposium for Testing and Failure Analysis (ISTFA) proceedings • Access to the EDFAS Membership Directory • Discount on registration for the annual ISTFA Conference and Exposition EDFAS, the Electronic Device Failure Analysis Society, focuses specifically on the reliability, testing, and failures of circuits, semiconductors, and other electronics platforms. SHAPE THE FUTURE OF YOUR CAREER FOR MORE INFORMATION: memberservicecenter@asminternational.org 440.671.3800 JOIN ONLINE: EDFAS.ORG
RkJQdWJsaXNoZXIy MTYyMzk3NQ==