edfas.org 39 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 3 Fault Isolation and Defect Localization: • Technique Selection for Front End of Line Defect Localization in Bulk Si FA (Fig. 1)—Complimentary access to this tutorial is available at www.asminternational.org/edfas/technical. • Defect Localization by Lock-In Thermography • Fault Isolation using Nano-EBAC/EBIC techniques. Sample Preparation: • Sample Preparation for Scanning Electron Microscopy Characterization and Failure Analysis of Advanced Semiconductor Devices • TEM Specimen Preparation and Failure Analysis of Advanced Semiconductor Devices • Advanced Physical Sample Preparation for Failure Analysis (Fig. 2)—Complimentary access to this tutorial is available at www.asminternational.org/ edfas/technical. Advanced Characterization Techniques: • Near-field Terahertz Imaging • Review of Atomic Force Microscopy (AFM) Methods for Failure Analysis • In-situ Correlative AFM-SEM Characterization for Failure Analysis • Scanning NV Magnetometry Circuit Modification Techniques: • Focused Ion Beam (FIB) for Chip Circuit Edit and Circuit Isolation For additional information on the EDFAS Education Subcommittee, contact Navid Asadi at nasadi@ufl.edu. NOTEWORTHY NEWS ESREF 2025 The 36th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2025) will take place October 6-9 in Bordeaux, France. This international symposium has a focus on reliability in all aspects of electronics including new applications in extremely harsh environments such as space, transport, energy conversion, and smart functions. It provides the leading European forum for developing all aspects of reliability management and innovative analysis techniques for present and emerging semiconductor applications. For more information, visit esref2025.sciencesconf.org. ITC 2025 The International Test Conference (ITC) will be held September 20-26 in San Diego. ITC is the world’s premier conference dedicated to the electronic test of devices, boards, and systems covering the complete cycle from design verification, test, diagnosis, failure analysis, and back to process and design improvement. At ITC, test and design professionals will confront the challenges the industry faces and learn how these issues are being addressed by the combined efforts of academia, design tool and equipment suppliers, designers, and test engineers. ITC, the cornerstone of TestWeek events, offers a wide variety of technical activities targeted at test and design theoreticians and practitioners. The conference includes paper sessions, keynotes, tutorials, case studies, and commercial exhibits and presentations, and a host of ancillary professional meetings. ITC is sponsored by the IEEE. For more information, visit itctestweek.org.
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