edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 3 38 The EDFAS Education Subcommittee strives for the development and delivery of educational products to the EDFAS membership. Keeping with its strategic focus on reaching a broader audience, including facilitating Q&A and educational exchanges on the ASM Connect platform, the Subcommittee presents short format videos on selected FA topics. These presentations are available on ASM Connect by selecting the Library tab in the EDFAS online community. Use the following link: bit.ly/3XI127k. An ASM Connect login is required. EDUCATION NEWS Navid Asadi nasadi@ufl.edu SPOTLIGHT ON TUTORIALS As the library of educational tutorial videos on ASM Connect continues to grow since its inauguration in 2020, for this issue, we are highlighting the list of videos and topics available. FA Procedures and Failure Mechanisms: • ESD Failure Mechanisms and Design Solutions • Failure Analysis Procedures • Failure Analysis of Advanced Microelectronics (a) (b) Fig. 2 Thermal relax of target device on board. (a) A Peltier placed underneath a large board with a thermal pad material and (b) an IR image of the part heated to 80°C. Fig. 1 Example of electron beam absorbed current (EBAC) logic net tracking. A 2.0 kV image (left) and an 8.0 kV image (right).
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