edfas.org 37 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 3 sectioning, EDX, FIB, precision cutting, secondary ion mass spectrometry (SIMS), x-ray (3D) examination, AFM analysis, dye and pry analysis, IC/package/PCB cost analysis, PCB reverse engineering, optical profiler, scanning capacitance microscopy, and transmission electron microscopy. IP RESEARCH GROUP 130 Terence Matthews Cr., Suite E1 Kanata, Ontario, Canada K2M 0J1 613.291.6599 technology@ipresearchgroup.com ipresearchgroup.com Services Offered: Integrated circuit reverse engineering, semiconductor process and materials analysis, and electronic product teardown and analysis. MUANALYSIS INC. 2301 St. Laurent Blvd., Suite 500 Ottawa, Ontario, Canada K1G 4J7 613.721.4664 info@muanalysis.com sales@muanalysis.com Services Offered: Failure analysis, material analysis, fabrication support, reliability testing and reliability analysis, teardown analysis, counterfeit detection, materials integrity verification, and training. Tools and Techniques: X-ray, scanning acoustic microscopy, decapsulation and package opening, optical microscopy and laser scanning microscopy (LSM), pin testing, static DC biasing, liquid crystal fault isolation, emission microscopy (EMMI), optical beam induced current (OBIC), backside emission microscopy, optical techniques for fault isolation, delayering, cross-sectioning, SEM, microprobing, with picoprobes, BGA layer by layer construction analysis, ESD and latchup testing, environmental testing, electrical testing, shear, bend and tensile testing, solderability testing, confocal scanning acoustic microscopy (CSAM), liquid crystal, scanning electron microscopy, spectroscopy, FTIR, Raman spectroscopy, energy dispersive x-ray, x-ray fluorescence (XRF) MuAnalysis joint integrity characterization (MAJIC), temperature cycling, process, and package and product qualifications. PHINEAS LABORATORY 1201 Cole Estates Dr. Georgetown, TX 78628 979.450.4960 justin@phineaslaboratory.com phineaslaboratory.com/methods Services Offered: Reverse engineering, electronic system design recovery (circuit-level extraction to full functionality mapping), failure analysis, and counterfeit semiconductor detection. Tools and Techniques: Hitachi SU3500 SEM, Oxford X-MaxN EDS system, Desk V thin film deposition solution, and ion milling system ArBlade 5000. REATISS LLC 15 Kazymyra Malevycha St. 03150, Kyiv, Ukraine REATISS Sp. z o.о. (affiliate) Ul.Swidnicka, nr.36, lok.12 Wroclaw, 50-068, Poland +380.44.200.8455 info@reatiss.com reatiss.com/Services/Patents Services Offered: Reverse engineering technical services provider with core specialty in IC reverse engineering and IP infringement analysis, product analysis, circuitry analysis, patent mining, and teardown. Tools and Techniques: Sample preparation, imaging, material and process analysis labs, optical microscopes, SEM, SEM-FIB, real-time x-ray, and EDX. REVENG 5 Bates Dr., Suite 8 Carleton Place, Ontario, Canada K7C 4J8 613.867.3979 info@revengic.com revengic.com/lab-services Services Offered: Reverse engineering services for microelectronics. Tools and Techniques: Process analysis, circuit extraction, intellectual property EoU, world-class microchip delayering, cross-sectioning, backside poly, bevel, EDX materials analysis, product teardown, die photo, PCB delayering, decapsulation, x-rays, PCB and IC analysis, device manipulation, sample imaging (optical or SEM), substrate staining n/p, TEM, and scanning capacitance microscopy. SAGE ANALYTICAL LAB 5744 Pacific Center Blvd., Suite 302 San Diego, CA 92121 858.255.8587 sagefalab.com/services/counterfeit-analysis Services Offered: ESD CDM failure analysis testing, ESD HBM and MM testing, latch-up testing, comprehensive IC failure analysis services, counterfeit analysis, backside IC editing services, PCB failure analysis, and destructive physical analysis. Tools and Techniques: Orion2 HD tester by Fisher Scientific, sub-micron 3D x-ray, Thermo-Scientific MK.4, particle sizing by dynamic light scattering (DLS), RTI megatrace system by Robson Technologies, JetEtch Pro – Cu protect system, Imina Integrated nanoprobing solutions for SEM and FIB, high-pin count parametric testing, chemical mechanical decapsulation, ion cross-section milling, polishing and cutting, 3D CT sub-micron x-ray analysis, solder joint integrity, Helios Nanolab 660 dual-beam FIB | SEM, OptiFIB-IV focused ion-beam, Hitachi model IM4000 milling system OBE 0038, Omniprobe Autoprobe 200, CAD navigation – Synopsys Camelot, QFI thermal emissions microscopy, photon emission microscopy (PEM), microprobing, electrical characterization, and AFP nanoprobing.
RkJQdWJsaXNoZXIy MTYyMzk3NQ==