edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 3 36 DIRECTORY OF INDEPENDENT FA PROVIDERS Rosalinda M. Ring, NenoVision jmj4papa@yahoo.com Electronic companies of all types and sizes require failure analysis (FA) services. Our goal is to supply a resource of FA service providers for your reference files. The directory lists independent providers and their contact information, expertise, and types of technical services offered. AAA TEST LAB 2320 Commerce Park Dr. NE, Suite G Palm Bay, FL 32905 877.369.6547 customerservice@aaactl.com aaactl.com/services Services Offered: In-house AS6081/AS6171 certified electrical testing lab, in-house PCB/hardware and software design lab, authentication testing, and environmental testing. Tools and Techniques: High current/high voltage semiconductor testing, component temperature testing, memory blank checking and programming, component up-screening, MIL-STD-883 static and dynamic burn-in, MIL-STD-883 temperature cycling, functional and electrical testing, microscopic inspections, x-ray analyses, scanning electron microscopes (SEM), x-ray, and XRF. ADVANCED COMPONENT TESTING 3279 Veterans Memorial Highway, #D8 Ronkonkoma, NY 11779 631.676.6390 sales@actestlab.com actestlab.com/contact-us Services Offered: Electrical testing, authenticity inspection, material analysis, and failure analysis. Tools and Techniques: Solderability and leak testing, temperature cycling, ISO 17025 accredited, DLA QTSL capable, AS6171 accredited, ISO 9001 certified, ANSI/ ESD-S20.20 certified, ACT services for aged inventory, FPGA testing capabilities, destructive physical analysis (DPA), fine/gross leak testing, solderability testing, device programming/blank verification, temperature cycling, external visual inspection, IC decapsulation/delidding, material analysis/device composition via XRF, physical dimension inspection, RoHS compliance/MIL lead compliance, x-ray inspection, blacktopping inspection, visual analysis via SEM, heated solvent testing, electrical curve tracing, mechanical scrape test, die verification via OCM die database, bake/dry pack, and tape and reeling. COVALENT METROLOGY SERVICES INC. 927 Thompson Place Sunnyvale, CA 94085 408.580.0605 covalentmetrology.com Services Offered: Failure analysis and material analysis services specializing in semiconductor, electronics, energy, medical devices, materials science and nanotechnology, analytical support including surface characterization, thin film analysis, materials composition, and dimensional metrology. Tools and Techniques: SEM, transmission electron microscopy (TEM), atomic force microscopy (AFM), and focused ion beam (FIB) techniques; spectroscopic methods such as energy dispersive x-ray spectroscopy (EDS), x-ray photoelectron spectroscopy (XPS), auger electron spectroscopy (AES), secondary ion mass spectrometry (SIMS), glow discharge optical emission spectroscopy (GDOES), Fourier transform infrared spectroscopy (FTIR), and x-ray fluorescence (XRF); x-ray-based analysis including x-ray diffraction (XRD), high-resolution XRD, and x-ray reflectometry (XRR); ellipsometry and optical profiling using spectroscopic ellipsometry, reflectometry, white light interferometry (WLI), and stylus profilometry; electrical and thin film characterization with four-point probe, hall effect, capacitance-voltage profiling, and film thickness measurement; surface/interface property testing such as surface roughness, contact angle/goniometry, surface energy, and adhesion; advanced sample preparation including cross-sectioning, ion milling, and plasma etching; and custom metrology consulting, data interpretation, and technique selection for R&D and product development. IC FAILURE ANALYSIS LAB 3506 W. Lake Center Dr., Suite D Santa Ana, CA 92704 949.329.0340 info@ICFailureAnalysis.com icfailureanalysis.com/#Contactus Services Offered: Failure analysis, microsurgery, reverse engineering, reliability testing, counterfeit component authenticity services in semiconductors, microelectronics, automotive, medical devices, telecommunications, aerospace, and military. Tools and Techniques: Scanning acoustic microscopy, x-ray (2D) examination, I-V (curve trace) measurement, chemical/laser decapsulation, photo emission microscopy (EMMI/OBIRCH), delayering/parallel lapping, SEM, cross-
RkJQdWJsaXNoZXIy MTYyMzk3NQ==