edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 3 34 The Hardware Reverse Engineering Workshop (HARRIS 2025) strives to bring together the international hardware reverse engineering community including partners from industry, academia, and government to facilitate an open exchange within the community, spark future collaborations, and advance the state of the art in hardware reverse engineering research. This year was the third annual HARRIS Workshop held over two days located at Ruhr University, Bochum (RUB) Germany, from March 17-18, harris2025.mpi-sp.org. This in-person workshop had over 120 attendees from approximately 20 different countries. The organizers laid out an agenda with six key speaker sessions covering: Hardware Trojans; ASIC reverse engineering; microarchitecture and FPGA reverse engineering; memory extraction; optical probing; and future directions in hardware reverse HARDWARE REVERSE ENGINEERING WORKSHOP HARRIS 2025 SUMMARY Michael DiBattista Varioscale Inc. miked@varioscale.com engineering. This year, the agenda included two plenary speakers. Andrew Zonenberg from IOActive spoke on extracting antifuse secrets from the RP2350 by FIB PVC and Andrew “Bunnie” Huang’s topic was Improving Trust in Supply Chains: Translating Research Into Everyday-Use Techniques. The workshop included a number of networking opportunities including Rapid Research Rendezvous, table topic discussions, and an informal event dinner at a restaurant in Bochum. The HARRIS workshop is organized by the Embedded Security group of the Max Planck Institute for Security and Privacy (MPI-SP) together with Ruhr University Bochum. Stay tuned for more information about the date for HARRIS 2026 for the 4th annual meeting. For more information, contact Dr. Maria-Bianca Leonte at pr@mpi-sp.org. HARRIS 2025 included more than 120 attendees from 20 countries. Visit the Electronic Device Failure Analysis Society website edfas.org
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