edfas.org 29 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 3 Device Failure Analysis Society (EDFAS) to stay ahead of emerging challenges in heterogeneous computing and advanced packaging. These expert-led sessions will delve into innovative methodologies for fault isolation, microscopy, package analysis, and physical failure analysis. This combination of focused short courses and in-depth tutorials will set the stage for a transformative learning experience, preparing industry professionals to lead the charge in innovation and technological advancement. Ted Kolasa of Northrop Grumman, ISTFA 2025 Technical Program Chair, has put together an outstanding Technical Program. The symposium will highlight high-quality, innovative, and original unpublished presentations across eighteen oral and poster sessions, with emerging failure analysis techniques continuing to be a major highlight. ISTFA 2025 authors are invited to submit manuscripts to the indexed conference proceedings and for publication in a special issue of ASM‘s Journal of Failure Analysis and Prevention. The symposium sessions will feature high-quality, innova- tive, and original unpublished presentations. The shift to advanced 3D integration and heterogeneous packaging presents new challenges in electrical fault isolation (EFI) and physical failure analysis (PFA) at both the device and package levels. These challenges, along with technologies like photonics and advanced materials that introduce unique inspection and reliability validation demands, will be highlighted. The ISTFA 2025 Panel will focus on Scaling Beyond Moore’s Law: Heterogeneous Computing and Ad- vanced Packaging. Esteemed experts from both academia and industry will converge to share their insights on the challenges facing failure analysis and the advancements required to navigate future development trends. These interactive conversations between the audience and the panel will foster the generation of innovative ideas and solutions in these state-of-the-art applications. The newly rebranded EDFAS International Roadmap for Failure Analysis (EDFAS IRFA)—designed to support failure analysis in the evolving landscape of semiconductor innovation—will be a Grounds of Pasadena City Hall. The courtyard restaurant of the Westin Pasadena.
RkJQdWJsaXNoZXIy MTYyMzk3NQ==