August 2025_EDFA_Digital

edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 3 28 ISTFA 2025 PREVIEW ISTFA 2025 Renee Parente, ISTFA 2025 Conference Chair AMD renee.parente@amd.com The 51st International Symposium for Testing and Failure Analysis (ISTFA) is scheduled to take place in Pasadena, California, from November 18 to 22. The event’s theme is “Scaling Beyond Moore’s Law: Heterogeneous Computing and Advanced Packaging.” As high-performance computing continues to push technological boundaries, expansions in advanced packaging, high-bandwidth I/O, heterogeneous compute architectures, device architectures, and silicon scaling are driving profound changes. While these innovations unlock new possibilities, they also introduce complex challenges to failure analysis, collectively reshaping the field in unprecedented ways. ISTFA is a crucial forum for the failure analysis community. It allows us to unite, share expertise, and drive collective progress in overcoming challenges. Dr. Raja Swaminathan, Corporate Vice President of Heterogeneous Integration Technologies at AMD, will deliver the ISTFA 2025 Keynote. His talk will focus on the future of artificial intelligence (AI) hardware, driven by advancements in packaging technology. Swaminathan will explore the pivotal role of chiplet architecture in sustaining the growth of AI hardware and edge computing, especially as Moore’s law slows. This shift has positioned advanced packaging at a critical crossroads, where technology and architecture converge to unlock unique product capabilities. He will highlight AMD’s industry-leading technology roadmap, featuring heterogeneous architectures such as 2.5D designs and 3D hybrid bonding, which optimize power, performance, area, and cost (PPAC). ISTFA 2025 will launch with Education Short Courses, equipping participants with deep insights into beambased defect localization and electronic device failure analysis—critical skills for today’s evolving electronics device failure analysis landscape. Building on this solid foundation, the program then shifts into an immersive, full day of Tutorials, reinforcing the imperative for the Electronics The Pasadena Convention Center.

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