edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 3 12 For system-level failure analysis, especially when investigating packaged devices, dynamic child overlays provide critical visibility into how individual dies or subcomponents are positioned relative to the larger system. This allows analysts to examine clearances, stacking tolerances, and potential interactions between different package elements, ensuring that no unintended mechanical or thermal damage happens during probing, deprocessing, or imaging. It also helps assess whether a defect location aligns with structural obstructions or bonding interfaces, which could otherwise complicate fault isolation. This overlay workflow enables high-precision crossdomain analysis, especially in scenarios where overlapping defects span multiple dies or reside at die-to-package boundaries. The dynamic, on-demand nature of the tool allows analysts to explore complex debug paths with agility, adjusting overlays based on current focus without overwhelming system resources. PERSISTENT ANNOTATION SHARING Annotations including markups, bounding boxes, labels, and probe points are central to collabora- tive failure analysis. However, in SIP systems, transfer- ring such annotations between parent and child CAD environments requires rigorous transformation to main- tain accuracy and context. The third solves this by implementing a complete import/export framework for annotation sharing between heterogeneous com- ponents. Unlike overlays, which are static visual images rendered temporarily on top of a layout for visual alignment, annotations represent live geometric and textual objects that can be manipulated, extended, or deleted within the receiving environment (Fig. 3). They are embedded into the destination layout’s coordinate system, enabling native interaction such as editing, labeling, measurement, or further markup. This persistent and editable nature makes them ideal for ongoing debug, documentation, and collaboration workflows. The tool operates in two modes: exporting annotations from a parent (e.g., package) to all children (e.g., dies), and importing annotations from children to the parent. It begins by capturing the relevant annotation content into a virtual layer file format, then parses each geometric primitive while applying affine transformations defined in the system configuration file. Transformation is applied to all coordinate-sensitive primitives—including boxes, wires, text, and polygons— while accounting for shrink factors, rotation angles, and mirror states. In addition to annotation primitives, virtual layers can be used to transfer full component or Fig. 3 Cross-database annotation sharing between board, substrate, interposer, and dies.
RkJQdWJsaXNoZXIy MTYyMzk3NQ==