edfas.org 1 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 3 ABOUT THE COVER “Vesuvius and Pompeii.” STEM darkfield image of highresistance contact. Photo by Wentao Qin, Brian Anderson, Randy Yach, and Denise Barrientos, Microchip Technology Inc., First Place Winner in False Color Images, 2024 EDFAS Photo Contest. A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS AUGUST 2025 | VOLUME 27 | ISSUE 3 edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS DEPARTMENTS Custom CAD Methodologies for Cross-Domain Failure Analysis in Advanced SIP Architectures Arpan Bhattacherjee and Arshdeep Singh By enabling synchronized navigation, cross-domain correlation, and real-time visualization across multiple databases, CAD tools help overcome IP silos and format fragmentation. Author Guidelines Author guidelines and a sample article are available at edfas.org. Potential authors should consult the guidelines for useful information prior to manuscript preparation. 4 10 2 GUEST EDITORIAL Marla L. Dowell 28 SPECIAL ISTFA 2025 PREVIEW Renee Parente 31 ISTFA EXHIBITORS LIST 32 2025 PHOTO CONTEST 33 2025 VIDEO CONTEST 34 HARRIS 2025 SUMMARY Michael DiBattista 36 DIRECTORY OF FA PROVIDERS Rosalinda Ring 38 EDUCATION NEWS Navid Asadi 40 LITERATURE REVIEW Michael R. Bruce 42 PRODUCT NEWS Ted Kolasa 44 INVENTORS CORNER Valerie Brogden 46 TRAINING CALENDAR Rosalinda Ring 48 ADVERTISERS INDEX Spectroscopic Characterization and Detection of Yield-Killing Defects in Micro-LED Wafers Praveena Manimunda This article describes the utility of multimodal spectroscopic metrology tools in characterizing μLED epi-wafers and identifying yield-killing microscopic defects. 16 For the digital edition, log in to edfas.org, click on the “News & Magazines” tab, and select “EDFA Magazine.” Electrical Resistivity and Residual Stress in Sputtered Indium Tin Oxide Thin Films Jianhui Liang, Jiali Zhang, Kurt Johanns, Oskar Amster, Blaise Cuénod, and Rémy Juttin Understanding and controlling the electric resistivity and residual stress of ITO films is crucial for ensuring the performance and reliability of devices using these films. 4 20 16 The Advantages of Systematically Defocusing the Ion Beam for Focused Ion Beam Workflows William M. Mook and Dustin D. Ellis Purposefully defocusing the ion beam for standard FIB processing leads to increased efficiency, reduced curtaining, and decreased thermal damage. 20 10
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