edfas.org 43 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO.2 metis.nist.gov. Sharing and exchanging data, models, and other data products allows for world-leading microelectronics research to be transferred to the marketplace, supporting U.S. security and commercial competitiveness. METIS is making research and data available in a manner that guards intellectual property, protects U.S. security interests, and is self-sustaining to meet future needs. We encourage you to join the CHIPS Metrology Community and explore the resources available there. REFERENCES 1. A. Balachandra, et al.: “Strategic Opportunities for U.S. Semiconductor Manufacturing, Special Publication (NIST SP),” National Institute of Standards and Technology, 2022, doi.org/10.6028/nist.chips.1000. 2. “Electronic Device Failure Analysis Technology Roadmap,” 2023, ASM International, doi.org/10.31399/asm.tb.edfatr.9781627084628. 3. CHIPS Metrology R&D projects, nist.gov/chips/research- development-programs/metrology-program. EXPLORE A WEALTH OF VALUABLE REFERENCE CONTENT ORGANIZED BY SUBJECT MATTER ✓Content is available in Print and Digital formats! ✓ASM Members Receive Discounts! POPULAR & NEW • Best Sellers • New Releases • All ASM Handbooks • All ASM Technical Books MATERIALS PROPERTIES AND SELECTION • Materials and Engineering Reference • Phase Diagrams and Crystal Data • Irons and Steels • Aluminum, Titanium, and Other Nonferrous Alloys • Nonmetallic Materials MATERIALS PROCESSING AND MANUFACTURING • Heat Treating • Surface Engineering • Metalworking • Welding and Other Joining Processes CHARACTERIZATION AND TESTING • Mechanical Testing • Metallography and Fractography • Failure Analysis • Microelectronics Failure Analysis MATERIALS DEGRADATION AND FAILURE MECHANISMS • Corrosion • Fatigue and Fracture • Friction and Wear Scan the QR code or visit asminternational.org/catalog to explore! ASM INTERNATIONAL DIGITAL CATALOG
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