edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 2 34 under test (DUT). The EZ500A can also be connected to an embedded thermal sensor. An optional Thermal Chuck is also available from Microsanj for added calibration flexibility. A proprietary TransientCAL technique is used to obtain an emissivity map for the DUT for enhanced temperature accuracy. For more information, visit microsanj.com. SECOND–—GEN DIGITAL SELECTED AREA PREPARATION SYSTEM PROVIDES UPGRADED FEATURES As a digital sample preparation system for the decapsulation, thinning, and polishing of die, package, module, and wafer-level devices, the new 2nd generation ASAP-1 IPS adds a suite of key feature upgrades. Drawing on Ultra Tec’s market knowledge and long-standing leadership in electronic device sample preparation, the IPS is ‘devicecentric’—designed to surpass the nondestructive, high yield, and survivability needs of labs needing to analyze microelectronic components. Machine vision cameras provide a unique alwayslive image of the device under test, along with key navigational and process controls. Auto head lift and lower, and optional fluid control system improve the user experience. The ASAP-1 IPS accurately decaps, thins, and polishes while allowing deep sub-micron control in all three axes. It can be used on die, package, wafer, and board-level devices and has a full 100 x 100 mm max stage area. The IPS Touch Screen OS has been redesigned to control all aspects of the sample preparation process. New or upgraded features for the 2nd generation model PRODUCT NEWS Ted Kolasa, Northrop Grumman ted.kolasa@gmail.com PRESS RELEASE SUBMISSIONS: MAGAZINES@ASMINTERNATIONAL.ORG THERMAL IMAGING SYSTEM ADDRESSES WIDE RANGE OF APPLICATIONS The SanjSCOPE EZ-THERM Lock-In Thermal Camera System by Microsanj provides an affordable platform to support both lock-in infrared (IR) emission thermography and lock-in thermoreflectance (TR) imaging. The EZ-THERM system consists of the EZ500A controller with a selection of high-performance IR or TR sensors to address a wide range of thermal imaging applications. The sensors are easily integrated to existing semiconductor test systems and the EZ500A controller can simultaneously support up to three sensors. The lock-in technique enables repeated time-gated measurements to be made over time to significantly improve the signal to noise ratio and subsequently enhance the thermal sensitivity of the instrument. With this approach, thermal sensitivities in the 1 mK range can be achieved enabling detection of hot spots with power levels less than 10 microwatts with the Microsanj IR sensor. With TR sensors, diffraction-limited spatial resolution addresses the resolution required for today’s advanced devices. The EZ500A supports multiple techniques for temperature calibration. Included is a high-resolution thermocouple for monitoring the temperature of the device The Microsanj EZ500A EZ THERM Lock-In Thermal Imaging System. The Ultra Tec Gen ASAP-1 IPS Prep System adds a suite of new feature upgrades.
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