edfas.org 33 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO.2 • K.A. Pareek, D. May, M.A. Ras, et al.: “Towards Development of an Intelligent Failure Analysis System based on Infrared Thermography,” Microelectronics Reliability, 2022, 139, p. 114823. • N.T.N. Sulthana and S. Joseph: “Infrared [Thermal] and Visible Image: Enhancement and Fusion using Adversarial Network,” AIP Conf. Proc., 2024, 3037, p. 020030. • C. J. Turner, Z. Hileman, V. Rosborough, et al.: “Thermal Imaging of Polymer-Based Photonic Wire Bond Through Thermoreflectance Microscopy,” IEEE Photonics Technology Letters, 2023, 35, p. 1115. • S. Veljković, N. Mitrović, I. Jovanović, et al.: “Selfheating of Stressed VDMOS Devices under Specific Operating Conditions,” Microelectronics Reliability, 2023, 150, p. 115213. • C. Yuan, R. Hanus, and S. Graham: “A Review of Thermoreflectance Techniques for Characterizing Wide Bandgap Semiconductors’ Thermal Properties and Devices’ Temperatures,” J. Appl. Phys., 2022, 132, p. 220701. • P. Zhu, D. Wu, L. Yin, et al.: “Quantitative Detection of Defect Size Based on Infrared Thermography: Temperature Integral Method,” Opt. Express, 2022, 30, p. 9119. EDFAS members enjoy these benefits: • Subscription to the Electronic Device Failure Analysis (EDFA) magazine • Subscription to the EDFA eNews • Online access to EDFA magazine articles • Online access to the Journal of Failure Analysis and Prevention (JFAP) • Online access to the 7th Edition Microelectronic Failure Analysis Desk Reference • Online access to all International Symposium for Testing and Failure Analysis (ISTFA) proceedings • Access to the EDFAS Membership Directory • Discount on registration for the annual ISTFA Conference and Exposition EDFAS, the Electronic Device Failure Analysis Society, focuses specifically on the reliability, testing, and failures of circuits, semiconductors, and other electronics platforms. SHAPE THE FUTURE OF YOUR CAREER FOR MORE INFORMATION: memberservicecenter@asminternational.org 440.671.3800 JOIN ONLINE: EDFAS.ORG
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