edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 2 32 LITERATURE REVIEW The current column comprises peer-reviewed articles published since 2020 on thermography and thermal-related phenomena. Note that inclusion in the list does not vouch for the article’s quality and category sorting is by no means strict. If you wish to share an interesting, recently published peer-reviewed article with the community, please forward the citation to the email address listed above and I will try to include it in future installments. Entries are listed in alphabetical order by first author, then title, journal, year, volume, and first page. Note that in some cases bracketed text is inserted into the title to provide clarity about the article subject. Peer Reviewed Literature of Interest to Failure Analysis: Thermography and thermal-related phenomena Michael R. Bruce, Consultant mike.bruce@earthlink.net • S. Alajlouni and A. Shakouri: “Surface Wetting to Enhance Thermoreflectance Characterization of Integrated Circuits,” Rev. Sci. Instrum., 2022, 93, p. 103701. • H. An, A.N. Amiri, D.P. Goronzy, et al.: “Enhanced Imaging of Electronic Hot Spots using Quantum Squeezed Light,” Appl. Phys. Lett., 2024, 124, p. 264001. • R.K. Apalowo, A. Abas, Z. Bachok, et al.: “Investigation of Hygrothermally Induced Failures in Multilayer Ceramic Capacitors during Thermal Reflow Process,” Microelectronics Reliability, 2023, 146, p. 115028. • H. Ather, H. An, A. Shakouri, et al.: “Quantum Sensing of Thermoreflectivity in Electronics,” Phys. Rev. Applied, 2023, 19, p. 044040. • J. Bodzenta and A. Kaźmierczak-Bałata: “Scanning Thermal Microscopy and its Applications for Quantitative Thermal Measurements,” J. Appl. Phys., 2022, 132, p. 140902. • D. Chalise, P. Kenesei, D.G. Cahill, et al.: “Temperature Mapping of Stacked Silicon Dies from X-Ray-Diffraction Intensities,” Phys. Rev. Applied, 2022, 18, p. 014076. • W.Y. Chen, X.L. Shi, J. Zou, et al.: “Thermoelectric Coolers for On-chip Thermal Management: Materials, Design, and Optimization,” Materials Science and Engineering: R: Reports, 2022, 151, p. 100700. • Y. Chen, M. Wu, J. Mo, et al.: “Thermoreflectance Property of Gallium Nitride,” Microelectronics Journal, 2024, 154, p. 106468. • Y. Dang, Y. Zhou, Y. Li, et al.: “Radiative Thermal Coats for Passive Temperature Management [in electronic circuits],” Appl. Phys. Lett., 2023, 123, p. 222201. • R. van Erp, R. Soleimanzadeh, L. Nela, et al.: “Co-designing Electronics with Microfluidics for More Sustainable Cooling,” Nature, 2022, 585, p. 211. • C. Ferrer, O. Aviñó, M. Vellvehi, et al.: “Die-Level Transient Thermal Imaging Based on Fourier Series Reconstruction for Power Industrial Electronics,” IEEE Transactions on Instrumentation and Measurement, 2023, 72, p. 1. • M. Käsbauer, P. Dreher, M. Sippel, et al.: “Mobile Ions Entering the IGBT Gate Oxide - Electrical Detection and Failure Localization by Lock-in Thermography,” Microelectronics Reliability, 2023, 150, p. 115064. • D. Kortge, K. Maize, A. Shakouri, et al.: “Concurrent Characterization of GaN MOSHEMT Gate Leakage via Electrical and Thermoreflectance Measurements,” Microelectronics Reliability, 2023, 148, p. 115122. • C.W. Mordue, J.M.R. Weaver and P.S. Dobson, “Thermal Induced Deflection in Atomic Force Microscopy Cantilevers: Analysis & Solution,” Measurement Science and Technology, 2023, 34, p. 125013. • T. Murakami, M. Shimofuri, T. Tsuchiya, et al.: “Noncontact Temperature [(Thermoreflectance)] Measurement of Metal Surfaces Using Reflected Laser Beam [in Electronic Devices],” Sensors and Materials, 2024, 36, p. 3445.
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