edfas.org 29 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO.2 EXPONENTIAL BUSINESS AND TECHNOLOGIES COMPANY (EBATCO) 10025 Valley View Rd., Suite 150 Eden Prairie, MN 55344 952.941.2199 866.832.2826 info@ebatco.com ebatco.com Services Offered: Nano analytical and testing (NAT) laboratory services, and consulting. Tools and Techniques: Differential scanning calorimetry (DSC), energy dispersive x-ray spectroscopy (EDS), Fourier transform infrared spectroscopy (FTIR), inductively coupled, plasma optical emission spectroscopy (ICP-OES), modulated DSC, Raman spectroscopy, refractive index, scanning electron microscopy (SEM), simultaneous thermal analysis (STA), thermogravimetric analysis (TGA), color measurement, contact angle, dynamic contact angle, interfacial tension, micro contact angle, powder contact angle, surface free energy, gloss measurement, density, inductively coupled plasma optical emission spectroscopy (ICP-OES), refractive index, rheology, surface/interfacial tension, turbidity, viscosity, mechanical, contact stylus, depth profiling, express property mapping (XPM), macro scratch, micro indentation, micro scratch, modulus mapping, nano DMA, nanoindentation, nano scratch, scratch testing ISO 1518, shore A and shore D hardness, and universal testing machine (UTM). GD4 TEST SERVICES INC. 5301 Riata Park Ct., Building E, Suite 120A Austin, TX 78727 512.535.1677 gd4test.com Services Offered: Third-party electronic components test lab, supports a full range of integrated circuit (IC) testing, programming, and packing options. Tools and Techniques: Bake and dry pack, bond pull testing, burn-in testing, constant acceleration, coplanarity testing, counterfeit screening, cross-section, C-SAM analysis, C-SEM analysis, decapsulation, device programming, die shear testing, dotting, electrical/functional testing, environmental testing, temperature cycle testing, highly accelerated stress testing (HAST), external visual inspection, failure analysis, group A testing, heated chemical testing (HCT), hermeticity and fine/gross leakage, JAN/ JANTX/JANS screening, life test, particle impact noise detection (PIND) test, resistance to solvents, restriction of hazardous substances (RoHS) compliance testing, solderability testing, solder dip, stabilization bake, tape and reel, upscreen testing, x-ray, and XRF. ITA LABS MATERIALS TESTING SOLUTIONS Unit 3, Curo Park, Frogmore, St. Albans Hertfordshire, AL2 2DD, UK +44.0.1727.871.300 support@italabs.co.uk italabs.co.uk Services Offered: Electronic services: coating and plating thickness testing, counterfeit components detection, electronics benchmarking, electronics failure analysis testing services, electronics reliability testing services, environmental testing services, harsh environmental testing, packaging testing, PCB quality control testing services, RoHS compliance testing services, RoHS screening service FAQ, and consultancy. Tools and Techniques: Electronics techniques, counterfeit components testing, dye and pry analysis, microsectioning, optical microscopy inspection, scanning acoustic tomography, solderability testing, thermal cycling testing, x-ray inspection, and 3D x-ray tomography. JESSE GARANT METROLOGY CENTER 400 Renaissance Center, Suite 2600 Detroit, MI 48243 313.996.5840 sales@jgarantmc.com jgarantmc.com/contact Services Offered: Computer tomography scanning, industrial x-ray, NDT inspection lab, and part sorting services. Tools and Techniques: Materials and geometry analyses using various x-ray tools. PHOTOMETRICS INC. 15801 Graham St. Huntington Beach, CA 92649 714.895.4465 lab@photometrics.net photometrics.net/analytical-techniques Services Offered: Adhesive failure analysis, chemical and material analysis, coating thickness and composition, contamination and corrosion identification, litigation support, metallurgical failure analysis, semiconductor constructional analysis, surface analysis, surface roughness, and thermal analysis. Tools and Techniques: Auger microanalysis, SEM, fieldemission SEM for high resolution work, EDS, FTIR, atomic force microscopy (AFM), DSC and TGA thermal analysis, in-lens field emission scanning electron microscopy, and optical microscopy. PROCESS SCIENCES INC. 310 Brushy St. Leander, TX 78641 512.259.7070 process-sciences.com Services Offered: BGA reballing/rework, circuit assembly rework and repair, x-ray inspection, failure analysis, SMT process validation, ion chromatography services, C3 ionic cleanliness testing, and counterfeit detection. Tools and Techniques: C3 ionic cleanliness testing, Bowman XRF tool, XRF plating thickness measurement, CT x-ray and virtual cross-sections, SEM|EDS, BGA crack analysis, microsection analysis, Dionex ion chromatography, and dye and pry test.
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