edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 2 24 The 7th annual IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE) was held in Huntsville, Alabama, at the Marriott Space and Rocket Center on November 11-13. The conference was loaded with three full days of presentations from industry leaders and sharp technical content focused on microelectronics security and supply chain challenges. This year, the 220 registered attendees represented a ten percent increase year over year and now includes 17 conference sponsors. Day 1 of the conference had a strong focus on packaging technology and assurance with Keynote speakers Jan Vardaman of TechSearch International Inc. and Jeff Krieg from the National Security Agency. An additional highlight was the panel discussion on Advanced Packaging Technology Challenges for Assurance featuring Carl McCants from DARPA, Len Orlando from Ansys Government Initiatives, Anthony Hill from Texas Instruments, Brandon Hamilton from BAE Systems, and Christopher Bailey from Arizona State University. Day 2 emphasized the importance of the U.S. CHIPS Act with a Keynote from George Orji on CHIPS for America: An Up- date on the National Advanced Packaging Manufacturing Program and a full line-up of presentations from NIST researchers, panel discussions, and CHIPS Metrology Rapid Talks. Day 3 led off with Keynote talks from Pauline Paki from the Department of Homeland Security and Chee Lip Gan of Nanyang Technological University and included a range of technical presentations covering side channel attacks, secure microelectronic tracking, and workforce development. The 2024 PAINE Best Paper was awarded to Kevin Pintong and Douglas Summerville for the presentation “Towards Reducing Costs of Side Channel Analysis for Real-time Algorithm Detection.” The best poster award went to Jon Scholl and coauthors at Batelle/AFRL for their work titled “Applying a Trusted Microelectronics Post-silicon Verification and Validation Workflow to Legacy Integrated Circuit Design Recovery.” PAINE also includes a University Lab Virtual Tour Competition with the opportunity to highlight different laboratories facilities and capabilities with the 2024 winning lab from University of Florida – Security and Assurance (SCAN) lab taking the top spot. The 8th annual meeting will be held on October 14–16 in Denver. For more information, visit paine-conference.org. 7TH IEEE INTERNATIONAL CONFERENCE ON PHYSICAL ASSURANCE AND INSPECTION OF ELECTRONICS (PAINE) Michael DiBattista, Varioscale Inc. miked@varioscale.com PAINE CONFERENCE SUMMARY Advertise in Electronic Device Failure Analysis magazine! For information about advertising in Electronic Device Failure Analysis: KJ Johanns, Business Development Manager 440.671.3851, kj.johanns@asminternational.org Current rate card may be viewed online at asminternational.org/advertise.
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