edfas.org 21 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO.2 microsections, Sn, O, and Cl- were found in the corrosion surface area. The mechanical behavior and the percentage of corroded area of the solder joints are clearly correlated. This has made it possible to define a failure criterion on the corroded surface of the solder joints. REFERENCES 1. M. Abueed, et al.: “Combined Creep and Fatigue Loadings on SAC305 Solder Joint,” SMTA International Conference 2020. 2. X. Long, et al.: “An Insight into Dynamic Properties of SAC305 Lead-free Solder under High Strain Rates and High Temperatures,” Int. J. Impact Eng., 2023, 175, p. 104542, doi.org/10.1016/ j.ijimpeng.2023.104542. 3. M. Wang, J. Wang, and W. Ke: “Corrosion Behavior of Sn-3.0Ag-0.5Cu Lead-free Solder Joints,” Microelectron. Reliab., 2017, 73, p. 69‑75, doi.org/10.1016/j.microrel.2017.04.017. 4. ASTM B117-09, Standard Practice for Operating Salt Spray (Fog) Apparatus. 5. K.E. Akoda, et al.: “Impact of Temperature on the Corrosion of Leadfree Solder Alloy during Salt Spray Test,” Microelectron. Reliab., 2021, 126, doi.org/10.1016/j.microrel.2021.114286. 6. K.E. Akoda, et al.: “Dynamics of the Corrosion for SAC305 Solder Alloy in Salt Environment,” 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022, doi. org/10.1109/EuroSimE54907.2022.9758896. 7. K.E. Akoda, et al.: “Dynamics of Corrosion on Mechanical and Electrical Reliability of SAC305 Solder Joints during Salt Spray Test,” Microelectron. Reliab., 2023, 150, doi.org/10.1016/ j.microrel.2023.115194. 8. United States Department of Defense. “Department of Defense Test Method Standard: Microcircuits,” MIL-STD-883F, 2010. 9. K. Yokoyama, D. Tsuji, and J. Sakai: “Fracture of Sustained Tensileloaded Sn–3.0Ag–0.5Cu Solder Alloy in NaCl Solution,” Corrosion Science, 2011, 53(10), p. 3331-3336. ABOUT THE AUTHORS Alexandrine Guédon-Gracia is an associate professor at the University of Bordeaux, affiliated with the IMS (Institute of Microelectronics, Microelectronics, and Nanotechnology) laboratory. She is a member of the reliability research group. Her research focuses on analyzing and improving the reliability of electronic assemblies, particularly lead-free solder joints. Komlan Elom Akoda obtained his Ph.D. in 2023 at the University of Bordeaux. Now, he works as material engineer in Akkodis Digital SAS, EDF. Hélène Frémont is a professor at the University of Bordeaux, specializing in microelectronics and the reliability of electronic components. Her research focuses on 3D integration, hybrid bonding, solder material aging, and moisture diffusion in materials. She has supervised 21 doctoral theses and authored over 200 scientific publications. J.Y. Delétage graduated from the University of Bordeaux, France, in 1995 and joined the IXL microelectronic laboratory of this University to work on microassemblies reliability research. He obtained his Ph.D. in 2003. Delétage works now in the IMS laboratory as a research engineer in the reliability group. He runs the experimental platform and aging test resources of the lab. Advertise in Electronic Device Failure Analysis magazine! For information about advertising in Electronic Device Failure Analysis: KJ Johanns, Business Development Manager 440.671.3851, kj.johanns@asminternational.org Current rate card may be viewed online at asminternational.org/advertise.
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